White paper on the future of plasma science and technology in plastics and textiles

被引:70
|
作者
Cvelbar, Uros [1 ,2 ]
Walsh, James L. [3 ]
Cernak, Mirko [4 ]
de Vries, Hindrik W. [5 ]
Reuter, Stephan [6 ]
Belmonte, Thierry [7 ]
Corbella, Carles [8 ]
Miron, Camelia [7 ]
Hojnik, Natasa [1 ,2 ]
Jurov, Andrea [1 ,2 ]
Puliyalil, Harinarayanan [9 ]
Gorjanc, Marija [10 ]
Portal, Sabine [11 ]
Laurita, Romolo [12 ]
Colombo, Vittorio [12 ,13 ]
Schaefer, Jan [6 ]
Nikiforov, Anton [14 ]
Modic, Martina [1 ]
Kylian, Ondrej [15 ]
Polak, Martin [6 ]
Labay, Cedric [16 ]
Canal, Jose M. [17 ]
Canal, Cristina [18 ]
Gherardi, Matteo [12 ,13 ]
Bazaka, Kateryna [19 ]
Sonar, Prashant [19 ]
Ostrikov, Kostya K. [19 ,20 ]
Cameron, David [21 ]
Thomas, Sabu [22 ]
Weltmann, Klaus-Dieter [6 ]
机构
[1] Jozef Stefan Inst, Jamova Cesta 39, SI-1000 Ljubljana, Slovenia
[2] Jozef Stefan Int Postgrad Sch, Jamova Cesta 39, SI-1000 Ljubljana, Slovenia
[3] Univ Liverpool, Dept Elect Engn & Elect, Ctr Plasma Microbiol, Brownlow Hill, Liverpool L69 3GJ, Merseyside, England
[4] Masaryk Univ, Fac Sci, R&D Ctr Low Cost Plasma & Nanotechnol Surface Mod, Dept Phys Elect, Kotlarska 267-2, CS-61137 Brno, Czech Republic
[5] Dutch Inst Fundamental Energy Res, FOM Inst DIFFER, POB 6336, NL-5600 HH Eindhoven, Netherlands
[6] INP Greifswald, Leibniz Inst Plasma Sci & Technol, Felix Hausdorff Str 2, D-17489 Greifswald, Germany
[7] Univ Lorraine, CNRS, Inst Jean Lamour, Dept CP2S,Equipe 201,UMR 7198, Parc Saurupt CS 50840, F-54011 Nancy, France
[8] Ruhr Univ Bochum, Inst Expt Phys 2, Univ Str 150, D-44801 Bochum, Germany
[9] Natl Inst Chem, Dept Catalysis & Chem React Engn, Hajdrihova 19, SI-1000 Ljubljana, Slovenia
[10] Univ Ljubljana, Fac Nat Sci & Engn, Askerceva 12, SI-1000 Ljubljana, Slovenia
[11] Ruhr Univ Bochum, Appl Solid State Phys, Univ Str 150, D-44801 Bochum, Germany
[12] Univ Bologna, Dept Ind Engn, Alma Mater Studiorum, Via Saragozza 8, I-40123 Bologna, Italy
[13] Univ Bologna, Interdept Ctr Ind Res Adv Mech Engn Applicat & Ma, Alma Mater Studiorum, Viale Risorgimento 2, I-40123 Bologna, Italy
[14] Univ Ghent, Dept Appl Phys, Sint Pietersnieuwstr 41 B4, B-9000 Ghent, Belgium
[15] Charles Univ Prague, Fac Math & Phys, V Holesovickach 2, Prague 18000 8, Czech Republic
[16] Tech Univ Denmark, Dept Micro & Nanotechnol, Ctr Nanomed & Theranost, DTU Nanotech, Bldg 423, DK-2800 Lyngby, Denmark
[17] Tech Univ Catalonia UPC, Dept Mat Sci & Met, Surfaces Prod & Text Proc Grp, Text Engn Sect,ESEIAAT, C Colom 1, Terrassa 08222, Spain
[18] UPC, Dept Mat Sci & Met, Biomat Biomech & Tissue Engn Grp, EEBE, C Eduard Maristany 10-14, Barcelona 08019, Spain
[19] Queensland Univ Technol, Sch Chem Phys & Mech Engn, Brisbane, Qld 4000, Australia
[20] CSIRO, CSIRO QUT Joint Sustainable Proc & Devices Lab, POB 218, Lindfield, NSW 2070, Australia
[21] Masaryk Univ, CEPLANT, Kotlarska 267-2, CS-61137 Brno, Czech Republic
[22] Mahatma Gandhi Univ, Sch Chem Sci, Int & Inter Univ Ctr Nanosci & Nanotechnol, Kottayam 686560, Kerala, India
基金
英国工程与自然科学研究理事会;
关键词
plasma; plastics; textile; trends; white paper; CHEMICAL-VAPOR-DEPOSITION; DIELECTRIC BARRIER DISCHARGE; ATOMIC LAYER DEPOSITION; COLLOIDAL QUANTUM DOTS; ATMOSPHERIC PLASMA; THIN-FILM; SURFACE MODIFICATION; GLOW-DISCHARGE; GAS SENSORS; TRIBOLOGICAL PERFORMANCE;
D O I
10.1002/ppap.201700228
中图分类号
O59 [应用物理学];
学科分类号
摘要
This white paper considers the future of plasma science and technology related to the manufacturing and modifications of plastics and textiles, summarizing existing efforts and the current state-of-art for major topics related to plasma processing techniques. It draws on the frontier of plasma technologies in order to see beyond and identify the grand challenges which we face in the following 5-10 years. To progress and move the frontier forward, the paper highlights the major enabling technologies and topics related to the design of surfaces, coatings and materials with non-equilibrium plasmas. The aim is to progress the field of plastics and textile production using advanced plasma processing as the key enabling technology which is environmentally friendly, cost-efficient, and offers high-speed processing.
引用
收藏
页数:37
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