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- [31] Thermoelectric Cooling Device Based on Holey Silicon PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 701 - 706
- [32] High-Performance Data Mapping for BNNs on PCM-based Integrated Photonics 2024 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, DATE, 2024,
- [33] EXPERIMENTAL INVESTIGATIONS ON THERMAL PERFORMANCE OF PCM BASED HEAT SINK FOR PASSIVE COOLING OF ELECTRONIC COMPONENTS PROCEEDINGS OF THE ASME 16TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNELS, AND MINICHANNELS, 2018, 2016,
- [36] Dynamic thermoelectric device SPICE model for transient cooling analysis 13TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, PROCEEDINGS, 2007, : 128 - 128
- [38] DYNAMIC PERFORMANCE CHARACTERISTICS OF A THERMOELECTRIC GENERATOR JOURNAL OF THERMAL ENGINEERING, 2019, 5 (05): : 385 - 395
- [39] Parametric Study on Thermal Performance of PCM Heat Sink Used for Electronic Cooling EXERGY FOR A BETTER ENVIRONMENT AND IMPROVED SUSTAINABILITY 1: FUNDAMENTALS, 2018, : 243 - 256