Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing

被引：2

作者：

Fukuda, Akira ^{[1
]}

Kodera, Akira ^{[2
]}

Toma, Yasushi ^{[2
]}

Suzuki, Tsukuru ^{[2
]}

Hiyama, Hirokuni ^{[2
]}

Doi, Toshiro ^{[1
]}

Kurokawa, Syuhei ^{[1
]}

Ohnishi, Osamu ^{[1
]}

机构：

[1] Kyushu Univ, Grad Sch, Fukuoka 8190395, Japan

[2] Ebara Corp, Kanagawa 2518502, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS | 2010年 / 49卷 / 07期

关键词：

PLANARIZATION ECMP; TECHNOLOGY; ACID; PAD;

D O I：

10.1143/JJAP.49.076701

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A new method for simulating the Cu removal rate in electrochemical mechanical polishing (ECMP) based on the dissolution-type polishing mechanism was developed. The effect of a protective layer on the Cu removal rate was considered in this method because the protective layer is a key element in the dissolution-type polishing mechanism. This method was used to simulate the removal rate in a rotary-type ECMP system. The simulations accurately provided the dependence of the Cu removal rate on the aperture ratio. Furthermore, the dependence of the Cu removal rate on the aperture ratio was described with respect to changes in the average protective layer amount with time. Regarding the dependence of the Cu removal rate on the aperture diameter, however, a discrepancy was observed between the simulation and experimental results because this method did not take into account the effect of the aperture diameter on the electrolyte-filling ratio in apertures. (C) 2010 The Japan Society of Applied Physics

引用

页码：0767011 / 0767018

页数：8

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