Diffusion performance of moisture in conductive adhesive interconnection structure

This paper studied on the environment temperature and humidity setting of conductive adhesive in microelectronic packaging, and established DGEBA / MPD linear homo- polymer model which simplified the conductive adhesive based on material Studio software, to access to diffusion mean square displacement curve in the different temperature and humidity water in DGEBA / MPD polymer. Based on the Einstein formula, through the mean square displacement curve to calculate the slope (a) showed that under the same low humidity conditions, the temperature is high, the water diffusion coefficient is larger, the diffusion is faster. According to different humidity conditions, under the same temperature and low humidity conditions, the diffusion coefficient of water molecules increases with the increase of humidity. Correlation algorithm simulated the diffusion of water molecules and it helped to improve the efficiency of the use of conductive adhesive. Relevant analysis is helpful to guide the conductive adhesive interconnect process parameter settings.