Densely Packed Tethered Polymer Nanoislands: A Simulation Study

被引:0
|
作者
Chen, Nicolas [1 ]
Davydovich, Oleg [2 ]
McConnell, Caitlyn [1 ]
Sidorenko, Alexander [1 ]
Moore, Preston B. [1 ]
机构
[1] Univ Sci Philadelphia, Dept Chem & Biochem, Philadelphia, PA 19104 USA
[2] 2720 Beckman Inst, 405 North Mathews Ave, Urbana, IL 61801 USA
基金
美国国家科学基金会;
关键词
polymers; surfaces; simulation; COMPUTER-SIMULATIONS; FLOW-CONTROL; BRUSHES; MICROCHANNELS; ADSORPTION; SURFACES;
D O I
10.3390/polym13152570
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
COordinated Responsive Arrays of Surface-Linked polymer islands (CORALS) allow for the creation of molecular surfaces with novel and switchable properties. Critical components of CORALs are the uniformly distributed islands of densely grafted polymer chains (nanoislands) separated by regions of bare surface. The grafting footprint and separation distances of nanoislands are comparable to that of the constituent polymer chains themselves. Herein, we characterize the structural features of the nanoislands and semiflexible polymers within to better understand this critical constituent of CORALs. We observe different characteristics of grafted semiflexible polymers depending on the polymer island's size and distance from the center of the island. Specifically, the characteristics of the chains at the island periphery are similar to isolated tethered polymer chains (full flexible chains), while chains in the center of the island experience the neighbor effect such as chains in the classic polymer brush. Chains close to the edge of the islands exhibit unique structural features between these two regimes. These results can be used in the rational design of CORALs with specific interfacial characteristics and predictable responses to external stimuli. It is hoped that this the discussion of the different morphologies of the polymers as a function of distance from the edge of the polymer will find applications in a wide variety of systems.
引用
收藏
页数:15
相关论文
共 50 条
  • [21] Electrical conductivity modeling and experimental study of densely packed SWCNT networks
    Jack, D. A.
    Yeh, C-S
    Liang, Z.
    Li, S.
    Park, J. G.
    Fielding, J. C.
    NANOTECHNOLOGY, 2010, 21 (19)
  • [22] Preparation of a Densely Packed Carbon Material
    Dmitriev, K. I.
    SOLID FUEL CHEMISTRY, 2019, 53 (05) : 303 - 307
  • [23] Nanofabrication of densely packed metal-polymer arrays for surface-enhanced Raman spectrometry
    De Jesús, MA
    Giesfeldt, KS
    Oran, JM
    Abu-Hatab, NA
    Lavrik, NV
    Sepaniak, MJ
    APPLIED SPECTROSCOPY, 2005, 59 (12) : 1501 - 1508
  • [24] Multiscale modeling and simulation of polymer-tethered silsesquioxane assemblies
    Chan, ER
    Zhang, X
    Lee, CY
    Neurock, M
    Striolo, A
    McCabe, C
    Cummings, PT
    Kieffer, J
    Glotzer, SC
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2005, 230 : U1253 - U1254
  • [25] A molecular dynamics study of laser melting of densely packed stainless steel powders
    Peng, Kaiyuan
    Huang, Haihong
    Xu, Hongmeng
    Kong, Yu
    Zhu, Libin
    Liu, Zhifeng
    INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2023, 243
  • [26] Image classification and segmentation for densely packed aggregates
    Wang, Weixing
    ADVANCES IN KNOWLEDGE DISCOVERY AND DATA MINING, PROCEEDINGS, 2007, 4426 : 887 - 894
  • [27] Homogeneous and Disordered Assembly of Densely Packed Nanocrystals
    Oaki, Yuya
    Anzai, Takeo
    Imai, Hiroaki
    ADVANCED FUNCTIONAL MATERIALS, 2010, 20 (23) : 4127 - 4132
  • [28] Hopping parameters in densely packed submicron crystallites
    Huijbregts, L. J.
    Brom, H. B.
    Brokken-Zijp, J. C. M.
    Yuan, M.
    Michels, M. A. J.
    PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 5, NO 3, 2008, 5 (03): : 765 - 767
  • [29] Polypeptide vesicles with densely packed multilayer membranes
    Song, Ziyuan
    Kim, Hojun
    Ba, Xiaochu
    Baumgartner, Ryan
    Lee, Jung Seok
    Tang, Haoyu
    Leal, Cecilia
    Cheng, Jianjun
    SOFT MATTER, 2015, 11 (20) : 4091 - 4098
  • [30] Thermal modeling of densely packed electronic systems
    Maudgal, V
    TWELFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS, 1996, : 97 - 104