Enclosed SU-8 and PDMS microchannels with integrated interconnects for chip-to-chip and world-to-chip connections

This paper presents the simulation, fabrication and testing of fluid-tight enclosed microchannels with integrated interconnects for modular snap-together chip-to-chip and world-to-chip connections. Components consisting of microchannels with integrated interconnect were fabricated in SU-8 photopolymer and polydimethylsiloxane (PDMS). Simulations were performed in ANSYS for component microchannels with chip-to-chip and world-to-chip interconnects in order to determine the expected flow profile and pressure drop. Components with world-to-chip structures were then experimentally pressurized to 252 kPa and 148 kPa for SU-8 and PDMS respectively, without leakage. Components with chip-to-chip interconnects were assembled in a hybrid configuration utilizing SU-8 and PDMS for individual components assembled in a chain, and pressurized to 124 kPa before leakage. The duality of these structures as both world-to-chip and chip-to-chip connections increases their usability since they can provide micro-to macro-connections, as well as chip-to-chip connections without needing to redesign the interconnection scheme.