Jammed packings of repulsive elastic spheres have emerged as a rich model system within which the elastic properties of disordered glassy materials may be elucidated. Most of the work on these packings has focused on the case of vanishing temperature. Here, we explore the elastic properties of the associated connectivity network for finite temperatures, ignoring the breaking of bonds and the formation of new ones. Using extensive Monte Carlo simulations, we find that, as the temperature is increased, the resulting spring network shrinks and exhibits a rapidly softening bulk modulus via a cusp. Moreover, the shear modulus stiffens in a fixed volume ensemble but not in a fixed pressure ensemble. These counter-intuitive behaviors may be understood from the characteristic spectrum of soft modes near isostaticity, which resembles the spectrum of a rod near its buckling instability. Our results suggest a generic mechanism for negative thermal expansion coefficients in marginal solids. We discuss some consequences of bond breaking and an apparent analogy between thermalization and shear.
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Univ Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
Univ Chicago, James Franck Inst, Chicago, IL 60637 USAUniv Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
Xu, Ning
Vitelli, Vincenzo
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Univ Penn, Dept Phys & Astron, Philadelphia, PA 19104 USAUniv Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
Vitelli, Vincenzo
Wyart, Matthieu
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Harvard Univ, HSEAS, Cambridge, MA 02138 USAUniv Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
Wyart, Matthieu
Liu, Andrea J.
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Univ Penn, Dept Phys & Astron, Philadelphia, PA 19104 USAUniv Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
Liu, Andrea J.
Nagel, Sidney R.
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Univ Chicago, James Franck Inst, Chicago, IL 60637 USAUniv Penn, Dept Phys & Astron, Philadelphia, PA 19104 USA
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Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USAYale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
Wu, Qikai
Bertrand, Thibault
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Univ Paris 06, CNRS, UPMC, Lab Jean Perrin,UMR 8237, F-75255 Paris, FranceYale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
Bertrand, Thibault
Shattuck, Mark D.
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Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
CUNY City Coll, Dept Phys, New York, NY 10031 USA
CUNY City Coll, Benjamin Levich Inst, New York, NY 10031 USAYale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
Shattuck, Mark D.
O'Hern, Corey S.
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Yale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
Yale Univ, Dept Phys, New Haven, CT 06520 USA
Yale Univ, Dept Appl Phys, New Haven, CT 06520 USAYale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USA
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Univ Michigan, Ctr Study Complex Syst, Ann Arbor, MI 48109 USA
Univ Michigan, Dept Chem Engn, Ann Arbor, MI 48109 USAUniv Michigan, Ctr Study Complex Syst, Ann Arbor, MI 48109 USA
Ziff, Robert M.
Torquato, Salvatore
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Princeton Univ, Princeton Inst Sci & Technol Mat, Dept Chem, Dept Phys, Princeton, NJ 08544 USA
Princeton Univ, Program Appl & Computat Math, Princeton, NJ 08544 USAUniv Michigan, Ctr Study Complex Syst, Ann Arbor, MI 48109 USA