The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics

被引：36

作者：

Bar-Cohen, Avram ^{[1
]}

Asheghi, Mehdi ^{[2
]}

Chainer, Timothy J. ^{[3
]}

Garimella, Suresh, V ^{[4
]}

Goodson, Kenneth ^{[2
]}

Gorle, Catherine ^{[5
]}

Mandel, Raphael ^{[6
]}

Maurer, Joseph J. ^{[7
]}

Ohadi, Michael ^{[6
]}

Palko, James W. ^{[8
]}

Parida, Pritish R. ^{[3
]}

Peles, Yoav ^{[9
]}

Plawsky, Joel L. ^{[10
]}

Schultz, Mark D. ^{[3
]}

Weibel, Justin A. ^{[11
]}

Joshi, Yogendra ^{[12
]}

机构：

[1] Univ Maryland, College Pk, MD 20742 USA

[2] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

[3] IBM Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA

[4] Purdue Univ, Dept Mech Engn, W Lafayette, IN 47907 USA

[5] Stanford Univ, Dept Civil Engn, Stanford, CA 94305 USA

[6] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA

[7] MBO Partners, Arlington, VA 22202 USA

[8] UC Merced, Dept Mech Engn, Merced, CA 95343 USA

[9] Univ Cent Florida, Dept Mech Engn, Orlando, FL 32816 USA

[10] Rensselaer Polytech Inst, Dept Chem & Biol Engn, Troy, NY 12180 USA

[11] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA

[12] Georgia Inst Technol, Dept Mech Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2021年 / 11卷 / 10期

基金：

美国国家科学基金会;

关键词：

Heating systems; Substrates; Cooling; Heat sinks; Heat transfer; Pins; Thermal management; Chip cooling; evaporative cooling; thermal management; two-phase thermal modeling; CONVECTIVE HEAT-TRANSFER; SINK ARRAY; FLOW; MICROCHANNEL; PPF;

D O I：

10.1109/TCPMT.2021.3111114

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram Bar-Cohen during 2012-2015 to target an order of magnitude improvement in chip level and hot spot heat fluxes, compared to the then state-of-the-art (SOA). Evaporative cooling technologies to achieve potential targets of 1 kW/cm(2) at the chip level and 5 kW/cm(2) at the hot spot level were targeted. A key goal was to improve fundamental understanding of the evaporative cooling physics at the relevant scales, and a numerical modeling capability to enable the co-design of such solutions in emerging computing and communications systems. A summary of the five projects pursued under this effort is provided, including the key accomplishments and developed capabilities.

引用

页码：1546 / 1564

页数：19

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