Three-dimensional waveguide arrays for coupling between fiber-optic connectors and surface-mounted optoelectronic devices

被引:10
|
作者
Hiramatsu, S [1 ]
Kinoshita, M [1 ]
机构
[1] NTT Corp, Musashino Res & Dev Ctr, Elect Syst Integrat Technol Res Dev, Assoc Super Adv Elect Technol, Musashino, Tokyo 1808585, Japan
关键词
mechanically transferable (MT) connector; surface-mount technology (SMT); three-dimensional (3-D) waveguide array; wafer stack and lamination; waveguide connector;
D O I
10.1109/JLT.2005.853154
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the fabrication of novel surface-mountable waveguide connectors and presents test results for them. To ensure more highly integrated and low-cost fabrication, we propose new three-dimensional (3-D) waveguide arrays that feature two-dimensionally integrated optical inputs/outputs and optical path redirection. A wafer-level stack and lamination process was used to fabricate the waveguide arrays. Vertical-cavity surface-emitting lasers (VCSELs) and photodiodes were directly mounted on the arrays and combined with mechanical transferable ferrule using active alignment. With the help of a flip-chip bonder, the waveguide connectors were mounted on a printed circuit board by solder bumps. Using mechanical transferable connectors, which can easily plug into the waveguide connectors, we obtained multi-gigabits-per-second transmission performance.
引用
收藏
页码:2733 / 2739
页数:7
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