Mechanical behavior and, thermal stability of nanocrystalline copper film prepared by gas deposition method

被引：23
|
作者：
Kobiyama, M [1 ]
Inami, T
Okuda, S
机构：
[1] Ibaraki Univ, Fac Engn, Hitachi, Ibaraki 3168511, Japan
[2] Tsukuba Inst Sci & Technol, Ami, Ibaraki 3001151, Japan
来源：
SCRIPTA MATERIALIA | 2001年 / 44卷 / 8-9期
关键词：
physical vapor deposition; hardness test; copper; recrystallization and recovery;
D O I：
10.1016/S1359-6462(01)00834-X
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The effect of annealing on n-Cu specimens with various grain sizes prepared by the gas deposition method was studied using Vickers hardness tests. Nanocrystalline copper films with various grain sizes were prepared by the gas deposition method. The specimens as-deposited revealed a high microhardness which was four times larger than that of ordinary polycrystals.
引用
收藏
页码：1547 / 1551
页数：5
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