Influence of Weak Magnetic Field on Electrodeposition and Properties of Copper Films

The influence of a weak magnetic field (induction 0.3 x 10(-3) T) on the process of electrodeposition of a copper film as well as on the structure of its surface and the physical-mechanical properties is discussed. Electrochemical studies were performed using the potentiometric method. Surface morphology was studied using scanning electron microscopy. Physical and mechanical properties were determined by the reflectivity of the surface and the microhardness of the deposit. The deposition current density was 16 mA/cm(2). It is shown that the application of a magnetic field of 0.3 x 10(-3) T around an electrochemical cell decreases the time to establish the equilibrium electrode potential in the electrolyte. However, during electrolysis, it leads to a decrease in the rate of copper electrodeposition. The deposit formed in the presence of a magnetic field has a smaller grain size. This paper presents the scanning electron microscopy micrographs of the cathode and the anode surfaces after copper (II) reduction with and without a magnetic field. The copper film surfaces have an increased reflectivity. The microhardness of the copper deposits obtained under a weak magnetic field was 1623 MPa while the deposits obtained without the influence of a magnetic field had a microhardness of about 750 MPa.