Parallel computations of 3D flows in resin transfer molding

被引：2
|
作者：
Chang, W [1 ]
机构：
[1] Seoul Natl Polytech Univ, Dept Mold & Die Design, Seoul, South Korea
来源：
KSME INTERNATIONAL JOURNAL | 1998年 / 12卷 / 05期
关键词：
parallel computation; three dimensional mold flow analysis; resin transfer molding;
D O I：
10.1007/BF02945567
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
In this work, fast 3D non-isothermal mold flow simulation programs that take advantage of the new generation parallel supercomputers such as Gray C90 and TMC CM-5 are developed and evaluated. The codes are based on the FE/CV formulations and utilize "overfill and redistribute scheme" to enhance the flow front movement. They rely on recently developed fast iterative solvers: the generalized minimal residual solver and the quasi minimal residual solver. In the examples, the performance of the iterative solvers and the overfill and redistribute scheme is evaluated, and a 3D simulation using 104, 000 HEXA8 element mesh is performed.
引用
收藏
页码：999 / 1010
页数：12
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