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- [11] Effect of Protection Atmosphere's Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-solder Joints 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 442 - 445
- [12] EXPERIMENTAL INVESTIGATIONS ON STRENGTH OF MICRO-SOLDER JOINTS UNDER COMBINED TENSILE AND TORSIONAL LOADS 25TH DANUBIA-ADRIA SYMPOSIUM ON ADVANCES IN EXPERIMENTAL MECHANICS, 2008, : 99 - 100
- [15] Solder Joints Properties as Function of Multiple Reflow Vapor Phase Soldering Process 2012 35TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2012): POWER ELECTRONICS, 2012, : 155 - 160
- [16] Copper-tin Reaction and Preparation of Micro-solder Joints under High Frequency Alternating Magnetic Field 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1592 - 1594