Thick-film technology for sensor applications

被引：0
|
作者：
Belavic, D
Hrovat, M
Pavlin, M
Zarnik, MS
机构：
[1] Jozef Stefan Inst, HIPOT RR Doo, Ljubljana 1000, Slovenia
[2] HIPOT RR Doo, Sentjernej, Slovenia
来源：
INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2003年 / 33卷 / 01期
关键词：
thick-film technology; sensor; force sensor; pressure sensor;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The most important technologies for manufacturing sensors and transducers are semiconductor technology, thin- and thick-film technologies. Thick-film technology is used in two ways, to produce the sensor elements themselves and/or the electronic circuits for signal processing. In both cases are some common particular characteristics and ceramic interconnection technology is one of them. This paper is focused in mechanical sensors (pressure, load, force, etc) where the sensor elements are made with thick-film technology. The first application is thick-film load sensor for kitchen scale. The second application is thick-film sensing element for a low-cost force sensor designed for industrial applications. The third application is thick-film force sensor for belt dynamometer (toco sensor) for medical application in maternity hospital.
引用
收藏
页码：45 / 48
页数：4
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