Design for reliability (DFR) methodology for electronic packaging assemblies

被引：0
|
作者：
Pang, JHL [1 ]
Low, TH [1 ]
Xiong, BS [1 ]
Che, F [1 ]
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2003年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Design for reliability requires knowledge based in materials testing and modeling, finite element modeling and simulation, failure mechanism and life prediction and reliability tests for validation. A comprehensive mechanics characterization of electronic solders such as Sn/Pb and Pb-free solders has been established. Examples of conventional 2D and 3D Finite Element Analysis is provided for Thermal Cycling analysis of elastic-plastic-creep analysis of solder joints. The combined effect of modeling viscoelastic underfill and viscoplastic solder is reported for thermal cycling (TC) and thermal shock loading(TS). Two global-local modeling techniques for board-level analysis was calibated. The global-local 3D modeling techniques are global-local submodeling (GLS) and global-local-beam (GLB) methods.
引用
收藏
页码：470 / 478
页数：9
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