Investigation of Heat Transfer on Surface Mount Packages for Different Chip Materials

The allocation and design placement of devices consisting of thermal sensitive units and poor thermal design can affect the device performance and damage the device in the worst case scenario. This study investigates the effect of thermal performance on the surface mount package corresponding to difference chip material. COMSOL Multiphysics software was used to assess the thermal effect on the electronic package. All the simulations are conducted under an identical simulation environment. The heat is transferred from the chip through the mount package to the surroundings by conduction. Besides that, thermal conduction mechanism happens among the components and thermal convection occurs on the air-exposed surface. The temperature of surface mount package was analyzed. The simulation result indicates that the chip material of titanium beta 21s as chip material shows the highest temperature of 48.04 degrees C. While, magnesium as chip material shows the lowest temperature about 43.61 degrees C.