Analysis of Residual Stress Distribution in Rods after Drawing Process with Regard to Process Variables

被引:1
|
作者
Kuznetsova, E., V [1 ]
Kolmogorov, G. L. [1 ]
Evsina, A., V [1 ]
机构
[1] Peru Natl Res Polytech Univ, Dept Dynam & Strength Machines, 29 Komsomolsky, Perm 614990, Russia
关键词
D O I
10.1088/1742-6596/1945/1/012027
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Currently, many researchers pay attention to studying the influence of process variables on the quality of metal products after manufacture. The most common methods of metalworking are forming processes, in which a high degree of deformation, uneven plastic deformation, and elevated temperatures are utilized. In most cases of manufacturing using these methods, a self-balanced system of residual stresses is formed that significantly affects the accuracy, strength, durability, reliability, corrosion resistance, and fatigue strength of machine parts after manufacture and processing. At the same time, the level of technological residual stresses depends on the main process variables. And in this regard, the analysis of the residual stress calculation for the deformation of rods will identify the effect of process variables, mechanical properties of the material, the geometry of the workpiece on the level and distribution of formed residual stresses. The object of the study is distributions of residual stresses formed after plastic deformation in rods and wire. In the work, experimental data on the distribution of residual stresses in rods after drawing were investigated. The residual stress calculation method takes into account parameters of technology, geometry and mechanical constants of material. Dependencies of axial and circumferential residual stresses in steel rods and wires after drawing were found.
引用
收藏
页数:6
相关论文
共 50 条
  • [21] Insight into the Key Process Parameters on Residual Stress Distribution in Deep Drawing of Laser-Welded Blanks: Response Surface Modeling
    Aminzadeh, Ahmad
    Karganroudi, Sasan Sattarpanah
    Goldak, John
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024, 33 (08) : 4136 - 4148
  • [22] The Analysis of Temperature Field and Residual Stress Distribution during H-beam Cooling Process
    Zang, Yong
    Zhang, Bo
    Cui, Lihong
    Gao, Zhiying
    ADVANCED ENGINEERING MATERIALS, PTS 1-3, 2011, 194-196 : 20 - +
  • [23] Experimental study on residual stress distribution of laser rapid forming process
    Yang, J
    Chen, J
    Yang, H
    Lin, X
    Huang, WD
    RARE METAL MATERIALS AND ENGINEERING, 2004, 33 (12) : 1304 - 1307
  • [24] Influence of process parameters on residual stress distribution in backward tube spinning
    Duanya Jishu/Forging & Stamping Technology, 1997, 22 (04): : 23 - 25
  • [25] CHARACTERIZATION AND ANALYSES ON RESIDUAL STRESS AND DEFORMATION DISTRIBUTION IN LINE HEAT PROCESS
    Zhou B.
    Han X.
    Guo W.
    Liu Z.
    Tan S.-K.
    Transactions of the Royal Institution of Naval Architects Part A: International Journal of Maritime Engineering, 2016, 158 (A4): : A315 - A324
  • [26] CHARACTERIZATION AND ANALYSES ON RESIDUAL STRESS AND DEFORMATION DISTRIBUTION IN LINE HEAT PROCESS
    Zhou, B.
    Han, X.
    Guo, W.
    Liu, Z.
    Tan, S. -K
    INTERNATIONAL JOURNAL OF MARITIME ENGINEERING, 2016, 158 : A315 - A324
  • [27] NUMERICAL ANALYSIS OF THE DEEP DRAWING PROCESS INCLUDING THE HISTORY OF STRESS AND STRAIN
    Kaldunski, Pawel
    JOURNAL OF THEORETICAL AND APPLIED MECHANICS, 2018, 56 (03) : 781 - 792
  • [28] Influence of process parameters and bump geometry on the residual stress distribution in a chip-on-foil bonding process
    Suter, P
    Bauknecht, R
    Graf, T
    Duran, H
    Venter, I
    2005 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 43RD ANNUAL, 2005, : 513 - 517
  • [29] Effect of process variables on the structure, residual stress, and hardness of sputtered nanocrystalline nickel films
    R. Mitra
    R. A. Hoffman
    A. Madan
    J. R. Weertman
    Journal of Materials Research, 2001, 16 : 1010 - 1027
  • [30] Effect of process variables on the structure, residual stress, and hardness of sputtered nanocrystalline nickel films
    Mitra, R
    Hoffman, RA
    Madan, A
    Weertman, JR
    JOURNAL OF MATERIALS RESEARCH, 2001, 16 (04) : 1010 - 1027