Over 10 Gbps/ch compact active interposer module for high-speed and high-density chip level optical interconnects

被引：0
|
作者：
Mikawa, T [1 ]
Furuyama, H [1 ]
Hiramatsu, S [1 ]
Kinoshita, M [1 ]
Ibaragi, O [1 ]
机构：
[1] Assoc Super Adv Elect Technol, ASET, Elect Syst Integrat Technol Res Dept, Musashino, Tokyo 1808585, Japan
来源：
2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2003年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：368 / 369
页数：2
相关论文
共 50 条
  • [41] ASYMMETRIC, MULTI-CONDUCTOR LOW-COUPLING STRUCTURES FOR HIGH-SPEED, HIGH-DENSITY DIGITAL INTERCONNECTS
    GILB, JPK
    BALANIS, CA
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (12) : 2100 - 2106
  • [42] System-Level Characterization of Modal Signaling for High-Density Off-Chip Interconnects
    Milosevic, Pavle
    Schutt-Aine, Jose E.
    2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [43] Hybrid-Cascaded Modeling Strategy for 28Gbps High-Speed Transceivers in High-Density FPGA Packages
    Tan, Chit Zhung
    Yew, Yee Huan
    Jiang, Jenny
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 103 - 106
  • [44] High-speed, bi-directional dual-core fiber transmission system for high-density, short-reach optical interconnects
    Geng, Ying
    Li, Shenping
    Li, Ming-Jun
    Sutton, Clifford G.
    McCollum, Robert L.
    McClure, Randy L.
    Koklyushkin, Alexander V.
    Matthews, Karen I.
    Luther, James P.
    Butler, Douglas L.
    NEXT-GENERATION OPTICAL NETWORKS FOR DATA CENTERS AND SHORT-REACH LINKS II, 2015, 9390
  • [45] Power comparison between high-speed electrical and optical interconnects for inter-chip communication
    Cho, H
    Kapur, P
    Saraswat, KC
    PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 116 - 118
  • [46] A 10-Gbps high-speed single-chip Network Intrusion Detection and Prevention System
    Artan, N. Sertac
    Ghosh, Rajdip
    Guo, Yanchuan
    Chao, H. Jonathan
    GLOBECOM 2007: 2007 IEEE GLOBAL TELECOMMUNICATIONS CONFERENCE, VOLS 1-11, 2007, : 343 - 348
  • [47] Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects
    Beker, B
    Yee, I
    Miracky, R
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1379 - 1383
  • [48] Compact Electro-Optical Module with Polymer Waveguides on a Flexible Substrate for High-Density Board-Level Communication
    Weiss, J. R. M.
    Lamprecht, T.
    Meier, N.
    Dangel, R.
    Horst, F.
    Jubin, D.
    Beyeler, R.
    Offrein, B. J.
    OPTOELECTRONIC INTERCONNECTS AND COMPONENT INTEGRATION IX, 2010, 7607
  • [49] Automatic high-density polymer waveguide layout for on-board high-speed optical interconnect
    Huang, Zhijie
    Ma, Lin
    Kuang, Wanjing
    Shi, Ying
    He, Zuyuan
    2020 OPTO-ELECTRONICS AND COMMUNICATIONS CONFERENCE (OECC 2020), 2020,
  • [50] A high-level compact pattern-dependent delay model for high-speed point-to-point interconnects
    Murgan, Tudor
    Momeni, Massoud
    Ortiz, Alberto Garcia
    Glesner, Manfred
    IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN, DIGEST OF TECHNICAL PAPERS, ICCAD, 2006, : 491 - +
12345