Fabrication of Cu-Ni-Si alloy by melt spinning and its mechanical and electrical properties

被引:11
|
作者
Geng, Guihong [1 ]
Wang, Dongxin [2 ]
Zhang, Weiran [1 ]
Liu, Limeng [1 ]
Laptev, Alexander M. [1 ]
机构
[1] North Minzu Univ, Sch Mat Sci & Engn, Yinchuan 750021, Peoples R China
[2] Northwest Rare Met Mat Res Inst Ningxia Co Ltd, State Key Lab Special Rare Met Mat, Shizuishan 753000, Peoples R China
关键词
Copper alloys; Melt spinning; Aging; Tensile strength; Electrical conductivity; Microstructure; STRENGTH; MICROSTRUCTURE; DIFFRACTION; EVOLUTION; BEHAVIOR;
D O I
10.1016/j.msea.2020.138979
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Cu alloys with compositions of Cu-3.2Ni-0.7Si (wt. %) and Cu-2.8Ni-0.7Si (wt. %) were prepared by melt spinning. Effects of composition, spinning rate, aging temperature and time on microstructure, precipitation of reinforcing phases, mechanical and electrical properties of Cu-Ni-Si alloys were investigated. Melt spinning could produce continuous Cu alloy ribbons with thickness and width of the ribbons mainly dependent on the cooling rate. Columnar grains of super-saturated Cu-Ni-Si solid solutions grew in the ribbons. The melt-spun Cu-Ni-Si alloys had a faster aging kinetics in comparison with commercial alloys of similar compositions. Peak-aging of the melt spun alloys appeared after heating at 400 to 550 degrees C for 1 to 2 h to show maximum tensile strength of 650 to 700 MPa. Prolonged heating resulted in large precipitates on the grain boundaries and formation of precipitation-free zones around each grain with sharp drop of tensile strength. Precipitation of nano delta-Ni2Si rather than other phases was the main reason for the enhanced mechanical properties at peak-aging. The peak- and slightly over-aged ribbons had a good electric conductivity up to 55% IACS.
引用
收藏
页数:8
相关论文
共 50 条
  • [1] Enhanced Mechanical and Electrical Properties of a Cu-Ni-Si Alloy by Thermo-mechanical Processing
    Jiang, Lei
    Fu, Huadong
    Wang, Changsheng
    Li, Weidong
    Xie, Jianxin
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2020, 51 (01): : 331 - 341
  • [2] Enhanced Mechanical and Electrical Properties of a Cu-Ni-Si Alloy by Thermo-mechanical Processing
    Lei Jiang
    Huadong Fu
    Changsheng Wang
    Weidong Li
    Jianxin Xie
    Metallurgical and Materials Transactions A, 2020, 51 : 331 - 341
  • [3] Effect of heat treatment on the electrical and mechanical properties of a Cu-Ni-Si cast alloy
    Atapek, S. Hakan
    von Klinski-Wetzel, Katharina
    Heilmaier, Martin
    MATERIALS TESTING, 2022, 64 (08) : 1103 - 1111
  • [4] The effect of bimodal structure with nanofibers and normal precipitates on the mechanical and electrical properties of Cu-Ni-Si alloy
    Ahn, Jee Hyuk
    Han, Seung Zeon
    Choi, Eun-Ae
    Lee, Hyunjong
    Lim, Sung Hwan
    Lee, Jehyun
    Kim, Kwangho
    Hwang, Nong Moon
    Han, Heung Nam
    MATERIALS CHARACTERIZATION, 2020, 170
  • [5] Microstructure and mechanical properties of Cu-Ni-Si alloys
    Monzen, Ryoichi
    Watanabe, Chihiro
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 483-84 : 117 - 119
  • [6] Effect of continuous extrusion forming on mechanical properties of aged Cu-Ni-Si alloy
    Lu, Lin
    Ding, Zeming
    Zhang, Mengxiao
    Song, Hongwu
    Deng, Siying
    Zhang, Shihong
    MATERIALS TODAY COMMUNICATIONS, 2024, 39
  • [7] Microstructure and Mechanical Properties of Cu-Ni-Si Alloy Deformed by Differential Speed Rolling
    Lee, Seong-Hee
    Han, Seung Zeon
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2016, 26 (01): : 8 - 12
  • [8] Microstructure and properties of low concentration of Cu-Ni-Si alloy
    Liu F.
    Mi X.-J.
    Ma J.-M.
    Huang G.-J.
    Hong S.-B.
    Xie H.-F.
    Peng L.-J.
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2019, 29 (02): : 286 - 294
  • [9] Regulation of Ni-Si intermetallics in Cu-Ni-Si alloys and its influence on electrical breakdown properties
    Xie, Hui
    Jia, Lei
    Tao, Shiping
    Wei, Xin
    Lu, ZhenLin
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (04) : 3137 - 3145
  • [10] Effect of Ni/Si mass ratio on microstructure and properties of Cu-Ni-Si alloy
    Tao, Shiping
    Lu, Zhenlin
    Jia, Lei
    Xie, Hui
    Zhang, Jinlong
    MATERIALS RESEARCH EXPRESS, 2020, 7 (06)