Microstructure and properties of low concentration of Cu-Ni-Si alloy

被引：0
|
作者：
Liu F. [1 ,2 ]
Mi X.-J. [1 ]
Ma J.-M. [2 ]
Huang G.-J. [1 ]
Hong S.-B. [2 ]
Xie H.-F. [1 ]
Peng L.-J. [1 ,2 ]
机构：
[1] State Key Laboratory of Nonferrous Metals and Process, General Research Institute for Nonferrous Metals, Beijing
[2] Ningbo Xingyeshengtai Group Co. Ltd., Ningbo
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2019年 / 29卷 / 02期
基金：
中国国家自然科学基金;
关键词：
Ageing treatment; Low concentration Cu-Ni-Si alloy; Microstructure; Stress relaxation; Yield-tensile ratio;
D O I：
10.19476/j.ysxb.1004.0609.2019.02.09
中图分类号：
学科分类号：
摘要：
The effects of different theromechanical treatments on grain size, precipitate size and distribution of precipitation phase of low concentration of Cu-Ni-Si alloy were investigated by metallurgical microscopy, transmission electron microscopy. The mechanical properties and electrical conductivity of the alloy were also tested. The results show that the Cu-Ni-Si alloy has excellent properties (tensile strength is 579 MPa, yield strength is 521 MPa, yield-tensile ratio is 0.9, elongation is 9% and electrical conductivity is 52.2%IACS ) and the average of grain size is 25 μm, when the alloy is solution treated at vertical bright annealing furnace, cold rolled and aging treatment, which is relative to other four heat treatment processes. Compared with C70250 and TMg0.5 alloys, the low concentration of Cu-Ni-Si alloy has a good heat dissipation and reliable dimensional stability in the use processes of high power current, which can be widely used in the automotive connector field. © 2019, Science Press. All right reserved.
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页码：286 / 294
页数：8
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