Oxidation-induced whisker growth on the surface of Sn-6.6(La, Ce) alloy

被引:5
|
作者
Chuang, Tung-Han [1 ]
Lin, Hsiu-Jen [1 ]
Chi, Chih-Chien [1 ]
机构
[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan
关键词
rare-earth elements; oxidation; tin whiskers; hillocks;
D O I
10.1007/s11664-007-0249-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
During solidification of rare-earth (RE)-containing Sn-6.6(La, Ce) alloys, (La0.93Ce0.07)Sn-3 intermetallic clusters form in the near beta-Sn matrix. These (La0.93Ce0.07)Sn-3 intermetallics oxidize predominately after air storage at room temperature for short time periods. Accompanying the oxidation reaction, tin sprouts appear on the outer surface of the intermetallic clusters. Increasing the storage time at room temperature leads to the formation of thread-like tin whiskers. In specimens stored at 150 degrees C in an air furnace, only a small amount of tin sprouts can be found in the interior regions of the oxidized (La0.93Ce0.07)Sn-3 intermetallics. However, many coarse tin hillocks formed around the intermetallic clusters. The driving force for whisker growth is the compressive stress induced by the volume expansion of (La0.93Ce0.07)Sn-3, which extrudes the tin atoms released by the oxidation reaction of these RE intermetallics. In addition, the huge compressive stress accumulated by the volume expansion of the drastically oxidized RE intermetallics during 150 degrees C air storage extrudes the Sn-6.6(La, Ce) matrix around the RE oxides to form the coarse hillocks.
引用
收藏
页码:1697 / 1702
页数:6
相关论文
共 50 条
  • [1] Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
    Tung-Han Chuang
    Hsiu-Jen Lin
    Chih-Chien Chi
    [J]. Journal of Electronic Materials, 2007, 36 : 1697 - 1702
  • [2] Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment
    Crandall, E. R.
    Flowers, G. T.
    Dean, R. N.
    Bozack, M. J.
    [J]. PROCEEDINGS OF THE FIFTY-SIXTH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS, 2010, : 412 - 416
  • [3] Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy
    Chuang, T. H.
    Lin, H. J.
    Chi, C. C.
    [J]. SCRIPTA MATERIALIA, 2007, 56 (01) : 45 - 48
  • [4] Modeling of oxidation-induced growth stresses
    Limarga, AM
    Wilkinson, DS
    Weatherly, GC
    [J]. SCRIPTA MATERIALIA, 2004, 50 (12) : 1475 - 1479
  • [5] Tin whisker growth on immiscible Al–Sn alloy
    Yan Zhang
    Peigen Zhang
    Wei He
    Zhengming Sun
    [J]. Journal of Materials Science: Materials in Electronics, 2020, 31 : 1328 - 1334
  • [6] Surface oxide cracking associated with oxidation-induced grain boundary sliding in the underlying alloy
    Nychka, JA
    Pullen, C
    He, MY
    Clarke, DR
    [J]. ACTA MATERIALIA, 2004, 52 (05) : 1097 - 1105
  • [7] Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes
    Baated, Alongheng
    Hamasaki, Kyoko
    Kim, Sun Sik
    Kim, Keun-Soo
    Suganuma, Katsuaki
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (11) : 2278 - 2289
  • [8] Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes
    Alongheng Baated
    Kyoko Hamasaki
    Sun Sik Kim
    Keun-Soo Kim
    Katsuaki Suganuma
    [J]. Journal of Electronic Materials, 2011, 40 : 2278 - 2289
  • [9] Oxidization-Induced Tin Whisker Growth on the Surface of Sn-3.8Ag-0.7Cu-1.0Er Alloy
    Hao, Hu
    Shi, Yaowu
    Xia, Zhidong
    Lei, Yongping
    Guo, Fu
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2009, 40A (08): : 2016 - 2021
  • [10] Tin whisker growth on immiscible Al-Sn alloy
    Zhang, Yan
    Zhang, Peigen
    He, Wei
    Sun, Zhengming
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (02) : 1328 - 1334