Study on the impact of height of solder joints with compliant layer on stress and strain under thermal cycle

被引：0

作者：

Zhou Xingjin ^{[1
]}

Huang Chunyue ^{[1
]}

Liang Ying ^{[2
]}

Li Tianming ^{[3
]}

Shao Liangbin ^{[1
]}

机构：

[1] Guilin Univ Elect Technol, Sch Electromech Engn, Guilin 541004, Peoples R China

[2] Chengdu Aeronaut Vocat & Tech Coll, Dept Elect Engn, Chengdu 610021, Peoples R China

[3] Guilin Univ Aerosp Technol, Dept Automobile & Power Engineer, Guilin 541004, Peoples R China

来源：

2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年

关键词：

solder joints with complaint layer; finite element analysis; solder joints height; stress and strain;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure finite element analysis of the model was performed, the stress and strain distribution of the solder joints with complaint layer was obtained under the condition of thermal-structure, the influences of the height of solder joints with complaint layer structure were studied. Results shows that the compliant layer structure can reduce the stress and strain of solder joints effectively. With the increase height of solder joints with complaint layer, the maximum stress and strain of the solder joints decrease.

引用

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页数：6

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