AI chips: Challenges and opportunities

被引：0
|
作者：
Singer, Pete
机构：
来源：
SOLID STATE TECHNOLOGY | 2018年 / 61卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：23 / 24
页数：2
相关论文
共 50 条
  • [21] Integrating AI and dentistry: opportunities and challenges
    Chopra, Shivani
    Emran, Talha B.
    INTERNATIONAL JOURNAL OF SURGERY OPEN, 2024, 62 (05) : 679 - 680
  • [22] Generalizing AI: Challenges and Opportunities for Plug and Play AI Solutions
    Al Ridhawi, Ismaeel
    Otoum, Safa
    Aloqaily, Moayad
    Boukerche, Azzedine
    IEEE NETWORK, 2021, 35 (01): : 372 - 379
  • [23] Generative AI Meets Responsible AI: Practical Challenges and Opportunities
    Kenthapadi, Krishnaram
    Lakkaraju, Himabindu
    Rajani, Nazneen
    PROCEEDINGS OF THE 29TH ACM SIGKDD CONFERENCE ON KNOWLEDGE DISCOVERY AND DATA MINING, KDD 2023, 2023, : 5805 - 5806
  • [24] Translator Education in the AI Era: Challenges and Opportunities
    Zhu Yifan
    Guan Xinchao
    Linguist
    ContemporarySocialSciences, 2020, (02) : 144 - 155
  • [25] Opportunities and Challenges of AI on Satellite Processing Units
    Ghiglione, Max
    Serra, Vittorio
    PROCEEDINGS OF THE 19TH ACM INTERNATIONAL CONFERENCE ON COMPUTING FRONTIERS 2022 (CF 2022), 2022, : 221 - 224
  • [26] Incorporating AI into oncology practice: Opportunities and challenges
    Burris, Howard A.
    ANNALS OF ONCOLOGY, 2021, 32 : S232 - S232
  • [27] Generalist medical AI reimbursement challenges and opportunities
    Mahajan, Arjun
    Powell, Dylan
    NPJ DIGITAL MEDICINE, 2025, 8 (01):
  • [28] Google AI: Opportunities, Risks, and Ethical Challenges
    Maouche, Seraya
    CONTEMPORARY FRENCH AND FRANCOPHONE STUDIES, 2019, 23 (04) : 447 - 455
  • [29] Explainable AI for Healthcare 5.0: Opportunities and Challenges
    Saraswat, Deepti
    Bhattacharya, Pronaya
    Verma, Ashwin
    Prasad, Vivek Kumar
    Tanwar, Sudeep
    Sharma, Gulshan
    Bokoro, Pitshou N.
    Sharma, Ravi
    IEEE ACCESS, 2022, 10 : 84486 - 84517
  • [30] Educating AI Software Engineers: Challenges and Opportunities
    Bublin, Mugdim
    Schefer-Wenzl, Sigrid
    Miladinovic, Igor
    MOBILITY FOR SMART CITIES AND REGIONAL DEVELOPMENT - CHALLENGES FOR HIGHER EDUCATION (ICL2021), VOL 2, 2022, 390 : 241 - 251
12345