Boundary element analysis of the stress field at the singularity lines in three-dimensional bonded joints under thermal loading

被引:10
|
作者
Prukvilailert, Monchai [1 ]
Koguchi, Hideo [1 ]
机构
[1] Nagaoka Univ Technol, Dept Mech Engn, Nagaoka, Niigata 9402188, Japan
关键词
thermoelasticity; thermal stress; logarithmic singularity; stress singularity; three-dimensional joints; dissimilar materials; BEM;
D O I
10.2140/jomms.2007.2.149
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The stress distribution near a point on the stress singularity line of dissimilar materials in three-dimensional joints under thermal loading are investigated using BEM based on Rongved's fundamental solutions. Stress distributions for the material combinations in the singularity region, in the no singularity region, and in the boundary between them on the Dundurs composite plane are investigated. The influences of thermal expansion coefficients, loading conditions and dimensions on the stress distribution in three-dimensional joints composed of two blocks are examined. The stress intensity factors in three-dimensional joints under a uniform change in temperature are proportional to the temperature variation, 1 T, and depend on the difference in the thermal expansion coefficients. Furthermore, the level of the stress distributions around the stress singularity lines also increases significantly as the length of one side in the parallel cross section to the interface decreases.
引用
收藏
页码:149 / 166
页数:18
相关论文
共 50 条
  • [21] Three-dimensional unsteady thermal stress analysis by triple-reciprocity boundary element method
    Ochiai, Yoshihiro
    Sladek, Vladimir
    Sladek, Jan
    ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS, 2013, 37 (01) : 116 - 127
  • [22] Boundary element method for three-dimensional couple stress elastostatic analysis
    Dargush, Gary F.
    EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2025, 111
  • [23] Evaluation of intensities of singularity at three-dimensional piezoelectric bonded joints using a conservative integral
    Luangarpa, Chonlada
    Koguchi, Hideo
    EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2018, 72 : 198 - 208
  • [24] Three-dimensional stress singularity analysis around the solder joints in electronic packaging using Eigen analysis
    Prukvilailert, M
    Koguchi, H
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 709 - 716
  • [25] Dynamic three-dimensional stress prediction of window glass under thermal loading
    Wang, Qingsong
    Zhang, Yi
    Wang, Yu
    Sun, Jinhua
    He, Linghui
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2012, 59 : 152 - 160
  • [26] Influence of adhesive layer thickness on intensity of stress singularity at a vertex in three-dimensional joints with three layers (in case of external loading)
    Koguchi H.
    Nakajima M.
    Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 2010, 76 (768): : 102 - 110
  • [27] Three-dimensional boundary element assessment of a fibre/matrix interface crack under transverse loading
    Cisilino, AP
    Ortiz, JE
    COMPUTERS & STRUCTURES, 2005, 83 (10-11) : 856 - 869
  • [28] Stress analysis of three-dimensional contact problems using the boundary element method
    Segond, D
    Tafreshi, A
    ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS, 1998, 22 (03) : 199 - 214
  • [29] Interactive three-dimensional boundary element stress analysis of components in aircraft structures
    Foster, T. M.
    Mohamed, M. S.
    Trevelyan, J.
    Coates, G.
    Spence, S. H.
    Walker, S. K.
    ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS, 2015, 56 : 190 - 200
  • [30] Free-edge stress singularity of bonded dissimilar materials with an interlayer under thermal stress loading
    Ioka, Seiji
    Sakai, Takahiro
    Kubo, Shiro
    Zairyo/Journal of the Society of Materials Science, Japan, 2014, 63 (12) : 816 - 821