Evaluation of the Electrical Conductivity and Mechanical Properties of Cu-3Ti-1.5Ni-0.5Si Quaternary Alloy

被引:1
|
作者
Nnakwo, K. C. [1 ]
Odo, J. U. [1 ]
Eweka, K. O. [1 ]
Okafor, J. S. [1 ]
Ijomah, A. I. [1 ]
Maduka, E. A. [2 ]
Ugwuanyi, B. C. [3 ]
机构
[1] Nnamdi Azikiwe Univ, Dept Met & Mat Engn, Awka, Nigeria
[2] African Univ Sci & Technol, Dept Mat Sci & Engn, Abuja, Nigeria
[3] Enugu State Univ Sci & Technol, Dept Met & Mat Engn, Enugu, Nigeria
关键词
PRIOR COLD WORK; HIGH-STRENGTH; PRECIPITATION; MICROSTRUCTURE; TITANIUM; COPPER;
D O I
10.1007/s11837-022-05293-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A high strength and super electrical conductive Cu-3Ti-1.5Ni-0.5Si quaternary alloy with improved hardness and ductility has been developed. The alloy components were melted in an inert gas controlled vacuum melting furnace, rapidly cooled in ice, homogenized at 900 degrees C for 5 h, and age heat treated at an aging temperature of 480 degrees C for 1, 2, 3, 4, and 5 h, respectively. The strength, hardness, ductility, and the electrical conductivity of the developed alloys were investigated and the microstructure analyzed using scanning electron microscopy (SEM). The average grain size and particle size distributions were obtained and discussed. Results show that the alloy recorded high strength and hardness of 760 MPa and 385 HV, respectively, after aging for 5 h. These improvements were linked with the minimal average grain size of similar to 4.5 mu m and uniform particle size distribution. Excellent electrical conductivity and percentage elongation with maximum values of 37.4% IACS and 25.1%, respectively, were also recorded after 1 h. The studied Cu-3Ti-1.5Ti-0.5Si alloy demonstrated excellent combinations of ductility, strength, hardness, and electrical conductivity.
引用
收藏
页码:4174 / 4180
页数:7
相关论文
共 50 条
  • [31] Microstructure, mechanical properties and electrical conductivity of industrial Cu-0.5%Cr alloy processed by severe plastic deformation
    Wei, Kun Xia
    Wei, Wei
    Wang, Fei
    Du, Qing Bo
    Alexandrov, Igor V.
    Hu, Jing
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (03): : 1478 - 1484
  • [32] Effect of Ni Additions on the Microstructure, Mechanical Properties, and Electrical Conductivity of Al Alloy
    Yoo, Hyo-Sang
    Kim, Yong-Ho
    Kim, Cheol-Woo
    Choi, Se-Weon
    Son, Hyeon-Taek
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2021, 31 (12): : 672 - 676
  • [33] The effect of bimodal structure with nanofibers and normal precipitates on the mechanical and electrical properties of Cu-Ni-Si alloy
    Ahn, Jee Hyuk
    Han, Seung Zeon
    Choi, Eun-Ae
    Lee, Hyunjong
    Lim, Sung Hwan
    Lee, Jehyun
    Kim, Kwangho
    Hwang, Nong Moon
    Han, Heung Nam
    MATERIALS CHARACTERIZATION, 2020, 170
  • [34] Preparation of layered gradient Cu-Cr-Ti alloy with excellent mechanical properties, thermal stability, and electrical conductivity
    Fu, Shaoli
    Chen, Xiaohong
    Liu, Ping
    Zhou, Honglei
    Ma, Fengcang
    Li, Wei
    NANOTECHNOLOGY REVIEWS, 2022, 11 (01) : 3207 - 3217
  • [35] Simultaneously enhanced hardness and electrical conductivity in a Cu-Ni-Si alloy by addition of Cobalt
    Liu, Feng
    Li, Jiang
    Peng, Lijun
    Huang, Guojiang
    Xie, Haofeng
    Ma, Jimiao
    Mi, Xujun
    JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 862
  • [36] Effect of Ta substitution method on the mechanical properties of Ni3(Si,Ti) intermetallic alloy
    Imajo, Daiki
    Kaneno, Yasuyuki
    Takasugi, Takayuki
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 588 : 228 - 238
  • [37] The effect of Si additions on the sintering and sintered microstructure and mechanical properties of Ti-3Ni alloy
    Yang, Y. F.
    Luo, S. D.
    Bettles, C. J.
    Schaffer, G. B.
    Qian, M.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2011, 528 (24): : 7381 - 7387
  • [38] Simultaneously enhancing mechanical properties and electrical conductivity of Cu-0.5%Cr alloy as 5G connector material
    Chu, Zhu Qi
    Wei, Kun Xia
    Wei, Wei
    V. Alexandrov, Igor
    An, Xu Long
    Wang, Dan Dan
    Liu, Xiang Kui
    JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 948
  • [39] Investigation on the mechanical properties and frictional performance of Ni-Cu-Si alloy
    Wang, Shihang
    Jie, Jinchuan
    Dong, Bowen
    Liu, Shichao
    Wang, Tongmin
    Li, Tingju
    MATERIALS SCIENCE AND TECHNOLOGY, 2020, 36 (15) : 1671 - 1684
  • [40] Electrical and mechanical properties of plated Ni/Cu contacts for Si solar cells
    Kluska, Sven
    Bartsch, Jonas
    Buechler, Andreas
    Cimiotti, Gisela
    Brand, Andreas A.
    Hopman, Sybille
    Glatthaar, Markus
    5TH INTERNATIONAL CONFERENCE ON SILICON PHOTOVOLTAICS, SILICONPV 2015, 2015, 77 : 733 - 743