Basic aspects of acid generation processes in chemically amplified resists for electron beam lithography

被引:8
|
作者
Kozawa, T [1 ]
Tagawa, S [1 ]
机构
[1] Osaka Univ, Inst Sci & Ind Res, Ibaraki, Osaka 5670047, Japan
来源
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XXII, PT 1 AND 2 | 2005年 / 5753卷
关键词
chemically amplified resist; low energy electron; resolution; sensitivity; acid distribution;
D O I
10.1117/12.600150
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Acid generation processes of chemically amplified resists for electron beam (EB) lithography are different from those of chemically amplified photoresists. In chemically amplified EB resists, the role of acid generators is to produce not protons but counter anions of acids through the reactions with low energy electrons generated at ionization events. As the distribution of counter anions determines latent acid image, the dynamics of low energy electrons is important in EB lithography. In this paper, we made clear the effects of dielectric constants of base polymers, the initial separation distances between radical cations and electrons, and the reaction radii of acid generators on the sensitivity and resolution of chemically amplified resists.
引用
收藏
页码:361 / 367
页数:7
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