Green design for testability allocation model of complicated electronic equipment

被引:0
|
作者
Wang Baolong [1 ]
Huang Kaoli [1 ]
Wei Zhonglin [1 ]
Guo Rui [1 ]
机构
[1] Ordnance Engn Coll, Dept Missile Engn, Shijiazhuang 050003, Peoples R China
关键词
DFT; testability allocation model; green design; life cycle;
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Synthesizing present DFT techniques, structures, and approaches, relationships during deferent levels of testability guidelines of complicated electronic equipments are analyzed according to hierarchical testability model. Considering influences coming from reliability, maintainability and safety etc fully, testability allocation model of complicated electronic equipments is given. The model embodies the thought of '' green design ''. It is consistent with integrated design framework of electronic equipments. The computer aided testability allocation tool based on this model is strictly dependent on existing DFT standards. It is compatible with the rest of computer aided design tools of electronic equipments. Meanwhile, the result figured out from the model is easy to be achieved and suitable for management during life cycle of equipments.
引用
收藏
页码:3066 / 3069
页数:4
相关论文
共 50 条
  • [41] Application and design of distributed electronic interference equipment
    Xie, WJ
    Wang, SK
    ISTM/2005: 6th International Symposium on Test and Measurement, Vols 1-9, Conference Proceedings, 2005, : 8841 - 8843
  • [42] A STUDY ON ELECTRONIC EQUIPMENT COOLING SYSTEM DESIGN
    KANEOYA, R
    OGISO, K
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1970, 18 (1-2): : 13 - &
  • [43] ELECTRONIC DESIGN OF TELEX LINE EQUIPMENT.
    Ryser, H.
    Ulrich, B.
    Zimmer, Chr.
    Hasler review, 1986, 19 (03): : 49 - 60
  • [44] THE DESIGN OF ELECTRONIC EQUIPMENT USING SUBMINIATURE COMPONENTS
    MILLER, ML
    PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1950, 38 (02): : 130 - 135
  • [45] DESIGN OF TROPICAL-RESISTANT ELECTRONIC EQUIPMENT
    LASCARO, CP
    IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING, 1970, PMP6 (02): : 60 - &
  • [46] Study on integrated logistics network model and network design for waste electrical and electronic equipment
    Chang, Xiangyun
    Huo, Jiazhen
    Chen, Shiang
    2006 IEEE INTERNATIONAL CONFERENCE ON SERVICE OPERATIONS AND LOGISTICS, AND INFORMATICS (SOLI 2006), PROCEEDINGS, 2006, : 654 - +
  • [47] Component-as-a-Service for Electrical and Electronic Equipment: Business Model, Circularity, and Design Implications
    Hidalgo-Crespo, Jose
    Riel, Andreas
    Golinska-Dawson, Paulina
    Bunodiere, Alex
    Duflou, Joost R.
    SYSTEMS, SOFTWARE AND SERVICES PROCESS IMPROVEMENT, EUROSPI 2024, PT II, 2024, 2180 : 62 - 75
  • [48] Methodology of Testability Design of Electronic Components Based On the Boundary-Scan Method
    Ren, Zhanyong
    Liu, Dandan
    Zeng, Zhaoyang
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1088 - 1092
  • [49] A Baseline-based BIST Design Model for Software Testability
    Sui, Junhua
    Wang, Jianxin
    Liu, Huina
    Liu, Liquan
    PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY AND MANAGEMENT SCIENCE (ITMS 2015), 2015, 34 : 1395 - 1399