Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing of GaN

被引:21
|
作者
Wang, Jie [1 ]
Wang, Tongqing [1 ]
Pan, Guoshun [1 ]
Lu, Xinchun [1 ]
机构
[1] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
关键词
GaN; Chemical mechanical polishing; Catalyst concentration; Photocatalytic oxidation; Ultraviolet intensity; GALLIUM NITRIDE; SAPPHIRE; PLANARIZATION; CMP;
D O I
10.1016/j.apsusc.2016.03.208
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing (CMP) of GaN were deeply investigated in this paper. Working as an ideal homogeneous substrate material in LED industry, GaN ought to be equipped with a smooth and flat surface. Taking the strong chemical stability of GaN into account, photocatalytic oxidation technology was adopted in GaN CMP process to realize efficient removal. It was found that, because of the improved reaction rate of photocatalytic oxidation, GaN material removal rate (MRR) increases by a certain extent with catalyst concentration increasing. Cross single line analysis on the surface after polishing by Phase Shift MicroXAM-3D was carried out to prove the better removal effect with higher catalyst concentration. Ultraviolet intensity field in H2O2-SiO2-based polishing system was established and simulated, revealing the variation trend of ultraviolet intensity around the outlet of the slurry. It could be concluded that, owing to the higher planarization efficiency and lower energy damage, the UV lamp of 125 W is the most appropriate lamp in this system. Based on the analysis, defects removal model of this work was proposed to describe the effects of higher catalyst concentration and higher power of UV lamp. (C) 2016 Elsevier B.V. All rights reserved.
引用
收藏
页码:130 / 135
页数:6
相关论文
共 50 条
  • [41] The Effects of Nodular Colloidal Silica on Chemical Mechanical Polishing
    Haba, S., 1600, Japan Society of Applied Physics (42):
  • [42] Chemical mechanical polishing of tantalum: oxidizer and pH effects
    Du, T
    Tamboli, D
    Desai, V
    Chathapuram, VS
    Sundaram, KB
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2004, 15 (02) : 87 - 90
  • [43] Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass
    Venkatesh, VC
    Izman, S
    Mahadevan, SC
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2004, 149 (1-3) : 493 - 498
  • [44] EFFECTS OF POLYVINYL ALCOHOL ON SILICON CHEMICAL MECHANICAL POLISHING
    Lei, Shuangshuang
    Wang, Chenwei
    Wang, Shengli
    CONFERENCE OF SCIENCE & TECHNOLOGY FOR INTEGRATED CIRCUITS, 2024 CSTIC, 2024,
  • [45] The Study of Stress Effects in GaN Epilayers on Very Thin Sapphire Substrates Using Chemical Mechanical Polishing Technique
    Su, Yan-Kuin
    Kao, Chien-Chih
    Lin, Chuing-Liang
    Chen, Jian-Jhong
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (04)
  • [46] Effects of slurry pH on chemical and mechanical actions during chemical mechanical polishing of YAG
    Mu, Qing
    Jin, Zhuji
    Han, Xiaolong
    Yan, Ying
    Zhang, Zili
    Zhou, Ping
    APPLIED SURFACE SCIENCE, 2021, 563
  • [47] Evaluation of Cu ion concentration effects on Cu etching rate in chemical-mechanical polishing slurry
    Nishizawa, Hideaki
    Sugiura, Osamu
    Matsumura, Yoshiyuki
    Kinoshita, Masaharu
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2007, 46 (12-16): : L379 - L381
  • [48] Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing
    Wang, Yongguang
    Zhao, Yongwu
    An, Wei
    Ni, Zifeng
    Wang, Jun
    APPLIED SURFACE SCIENCE, 2010, 257 (01) : 249 - 253
  • [49] Evaluation of Cu ion concentration effects on Cu etching rate in chemical-mechanical polishing slurry
    Department of Physical Electronics, Tokyo Institute of Technology, Ookayama, Meguro-ku, Tokyo 152-8552, Japan
    不详
    不详
    Jpn J Appl Phys Part 2 Letter, 12-16 (L379-L381):
  • [50] Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
    Cheng, Jie
    Wang, Tongqing
    Wang, Jie
    Liu, Yuhong
    Lu, Xinchun
    MICROELECTRONIC ENGINEERING, 2016, 151 : 30 - 37