Heterogeneous systems on chip and systems in package

被引：0

作者：

O'Connor, I. ^{[1
]}

Courtois, B. ^{[2
]}

Chakrabarty, K. ^{[3
]}

Delorme, N. ^{[4
]}

Hampton, M. ^{[5
]}

Hartung, J. ^{[6
]}

机构：

[1] Ecole Cent Lyon, F-69130 Ecully, France

[2] TIMA Lab, Ecully, France

[3] Duke Univ, Durham, NC 27706 USA

[4] CEA Grenoble, LETI, F-38054 Grenoble, France

[5] Certess Inc, Campbell, CA 95008 USA

[6] Cadence Europe, Berlin, Germany

来源：

2007 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, VOLS 1-3 | 2007年

关键词：

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper discusses several forms of heterogeneity in systems on chip and systems in package. A means to distinguish the various forms of heterogeneity is given, with an estimation of the maturity of design and modeling techniques with respect to various physical domains. Industry-level AEMS integration, and more prospective microfluidic biochip systems are considered at both technological and EDA levels. Final v, specific flows for signal abstraction heterogeneity in RF SiP and for functional co-verification are discussed.

引用

页码：737 / +

页数：2

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