Disintegration of biomacromolecules by dielectric barrier discharge plasma in helium at atmospheric pressure

被引:17
|
作者
Hou, Ying Min [1 ]
Dong, Xiao Yu [1 ,2 ]
Yu, Hong
Li, Shuang [1 ]
Ren, Chun Sheng [3 ]
Zhang, Dai Jia [1 ]
Xiu, Zhi Long [1 ]
机构
[1] Dalian Univ Technol, Dept Biosci & Biotechnol, Dalian 116024, Peoples R China
[2] Dalian Univ, Bioengn Coll, Dalian 116622, Peoples R China
[3] Dalian Univ Technol, State Key Lab Mat Modificat Laser Ion & Electron, Dalian 116024, Peoples R China
基金
中国国家自然科学基金;
关键词
dielectric barrier discharge (DBD); disintegration; inactivation of cells; protein;
D O I
10.1109/TPS.2008.927630
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
The inactivation mechanism of microorganisms by plasma has been attracting much attention or researchers in recent years. Some different explanations have been postulated from physical, chemical, and biological views. In this paper, we investigate the inactivation mechanism of cells exposed to dielectric barrier discharge plasma in helium at atmospheric pressure from a biochemical view, i.e., disintegration of biomacromolecules, particularly the polysaccharide on cell wall and membrane-bound proteins. The experimental results showed that a series of complex chemical reactions happened in cell debris suspension and cell suspension, leading to a decrease in the concentration of membrane-bound proteins and an increase in the concentration of proteins released from cells. Cell debris could be effectively decomposed by plasma to amino acid, maltose, glucose, acetic acid, and so on. This might be the main reason for cell lysis and death.
引用
收藏
页码:1633 / 1637
页数:5
相关论文
共 50 条
  • [31] Plasma polymerization in a microcapillary using an atmospheric pressure dielectric barrier discharge
    Bashir, M.
    Rees, Julia M.
    Zimmerman, William B.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2013, 234 : 82 - 91
  • [32] Plasma nitriding technology using dielectric barrier discharge at atmospheric pressure
    Yan, L
    Zhu, XH
    Qin, Y
    Xu, JJ
    Gao, YZ
    [J]. CONTRIBUTIONS OF SURFACE ENGINEERING TO MODERN MANUFACTURING AND REMANUFACTURING, 2002, : 413 - 416
  • [33] Selection of dielectric material for producing diffuse dielectric barrier discharge plasma at atmospheric pressure
    Srivastava, Anand Kumar
    [J]. MATERIALS TODAY-PROCEEDINGS, 2019, 18 : 1033 - 1038
  • [34] Formation of Multi-pulse Glow Dielectric Barrier Discharge in Helium at Atmospheric Pressure
    Wang, Xiaolei
    Hao, Yanpeng
    Yang, Lin
    [J]. ICPADM 2009: PROCEEDINGS OF THE 9TH INTERNATIONAL CONFERENCE ON PROPERTIES AND APPLICATIONS OF DIELECTRIC MATERIALS, VOLS 1-3, 2009, : 610 - 613
  • [35] Analysis on Lissajous figures of dielectric barrier glow discharge in atmospheric-pressure helium
    School of Electric Power, South China University of Technology, Guangzhou 510640, China
    [J]. Gaodianya Jishu, 2012, 5 (1025-1032):
  • [36] Experimental Observations of Quasiperiodic Behavior in an Atmospheric-pressure Dielectric Barrier Discharge in Helium
    Dai, Dong
    Wang, Qi M.
    Luo, Ling
    [J]. 2014 IEEE INTERNATIONAL POWER MODULATOR AND HIGH VOLTAGE CONFERENCE (IPMHVC), 2014, : 485 - 487
  • [37] Influence of nitrogen impurities on the characteristics of a patterned helium dielectric barrier discharge at atmospheric pressure
    Zhang, Yuhui
    Ning, Wenjun
    Dai, Dong
    Wang, Qiao
    [J]. PLASMA SCIENCE & TECHNOLOGY, 2019, 21 (07)
  • [38] Influence of nitrogen impurities on the characteristics of a patterned helium dielectric barrier discharge at atmospheric pressure
    张雨晖
    宁文军
    戴栋
    王乔
    [J]. Plasma Science and Technology, 2019, 21 (07) : 23 - 37
  • [39] Columnar discharge mode between parallel dielectric barrier electrodes in atmospheric pressure helium
    Hao, Yanpeng
    Zheng, Bin
    Liu, Yaoge
    [J]. PHYSICS OF PLASMAS, 2014, 21 (01)
  • [40] Influence of nitrogen impurities on the characteristics of a patterned helium dielectric barrier discharge at atmospheric pressure
    张雨晖
    宁文军
    戴栋
    王乔
    [J]. Plasma Science and Technology, 2019, (07) : 23 - 37