Heat-pipes for electronic devices cooling and evaluation of their thermal performance

被引：0
|
作者：
Namba, K
Kimura, N
Niekawa, J
Kimura, Y
Hashimoto, N
机构：
来源：
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年
关键词：
D O I：
10.1109/ITHERM.1998.689602
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper reports on the performance of miniature heat-pipes developed for cooling of electronic equipment and on evaluating the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipe were conducted on their thermal properties and reliability. The results indicate the miniature heat-pipe can be applied to electronic equipment cooling, And evaluating tests of the cooling system using this miniature heal-pipe have clarified the effectiveness of the miniature heat-pipe.
引用
收藏
页码：456 / 459
页数：4
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