Heat-pipes for electronic devices cooling and evaluation of their thermal performance

被引：0
|
作者：
Namba, K
Kimura, N
Niekawa, J
Kimura, Y
Hashimoto, N
机构：
来源：
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS | 1998年
关键词：
D O I：
10.1109/ITHERM.1998.689602
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper reports on the performance of miniature heat-pipes developed for cooling of electronic equipment and on evaluating the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipe were conducted on their thermal properties and reliability. The results indicate the miniature heat-pipe can be applied to electronic equipment cooling, And evaluating tests of the cooling system using this miniature heal-pipe have clarified the effectiveness of the miniature heat-pipe.
引用
收藏
页码：456 / 459
页数：4
相关论文
共 50 条
  • [1] Heat-pipes for electronic devices and evaluation of their thermal performance
    Namba, K
    Niekawa, J
    Kimura, Y
    Hashimoto, N
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 91 - 94
  • [2] A Testing System for Thermal Properties of Solar Gravity Heat-pipes
    Xu, Jianbin
    Chen, Le
    Han, Leitao
    Shen, Bin
    PROCEEDINGS OF THE 2015 10TH IEEE CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS, 2015, : 930 - 933
  • [3] Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices
    Wang, Zhengde
    INTERNATIONAL JOURNAL OF HEAT AND TECHNOLOGY, 2021, 39 (02) : 451 - 459
  • [4] Opportunities and Challenges of Employing Heat-Pipes in Thermal Management of Electrical Machines
    Wrobel, R.
    McGlen, R. J.
    2020 INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES (ICEM), VOL 1, 2020, : 961 - 967
  • [5] THE USE OF VAPOR CHAMBERS AND HEAT PIPES FOR COOLING MILITARY EMBEDDED ELECTRONIC DEVICES
    Connors, Matthew J.
    Zunner, John A.
    MILCOM 2009 - 2009 IEEE MILITARY COMMUNICATIONS CONFERENCE, VOLS 1-4, 2009, : 1474 - 1480
  • [6] Heat transfer mechanisms in pulsating heat-pipes with nanofluid
    Gonzalez, Miguel
    Kelly, Brian
    Hayashi, Yoshikazu
    Kim, Yoon Jo
    APPLIED PHYSICS LETTERS, 2015, 106 (01)
  • [7] Miniature heat pipes as compressor cooling devices
    Possamai, F. C.
    Setter, I.
    Vasiliev, L. L.
    APPLIED THERMAL ENGINEERING, 2009, 29 (14-15) : 3218 - 3223
  • [8] Performance of a semicircular microchannel heat sink in cooling of electronic devices
    Sunny, Chandra
    Om, Prakash
    UPB Scientific Bulletin, Series D: Mechanical Engineering, 2020, 83 (02): : 137 - 148
  • [9] Performance of a semicircular microchannel heat sink in cooling of electronic devices
    Sunny, Chandra
    Om, Prakash
    UPB Scientific Bulletin, Series D: Mechanical Engineering, 2021, 83 (02): : 137 - 148
  • [10] Miniature loop heat pipes for electronic cooling
    Hoang, TT
    Ku, J
    Butler, CD
    Swanson, TD
    ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 2, 2003, : 517 - 525
12345