EMC-oriented full-wave modelling of passive MMIC structures for wireless applications

A class of full-wave models useful to tackle EMC problems in passive MMIC structures, as well as in conventional electronic circuitry, employed in wireless technology applications is presented. Upon using the appropriate dyadic Green's function, the prediction of undesired EMI effects, a widely addressed problem in high package-density modules, is performed by accounting for both electromagnetic coupling and surface/volume wave excitation. Particular efforts have been devoted to the simulation of circuits in realistic exciting/loading situations through the derivation of equivalent network representations. The resulting full-wave models allow an accurate prediction of possible EMC problems in MMICs already during the design stage, thus paving the way to low-cost solutions far EMI reduction.