HW/SW Co-design for Reconfigurable Ultrasonic System-on-Chip Platform

被引:0
|
作者
Govindan, Pramod [1 ]
Gilliland, Spenser [1 ]
Gonnot, Thomas [1 ]
Saniie, Jafar [1 ]
机构
[1] IIT, Dept Elect & Comp Engn, Chicago, IL 60616 USA
关键词
D O I
暂无
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
Efficient partitioning of hardware and software is essential for an optimized system design with a reduced development time. A reconfigurable Ultrasonic System-on-Chip Hardware (RUSH) platform has been developed to allow flexibility in system development for real-time ultrasonic signal processing applications via hardware-software (HW/SW) co-design. In this paper, we analyze how the various components within the RUSH system are split into hardware and software. Hence RUSH provides an industry standard development platform for both hardware and software designers.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] SoC Design with HW/SW Co-Design Methodology for Wireless Communication System
    Surantha, Nico
    Sutisna, Nana
    Nagao, Yuhei
    Ochi, Hiroshi
    [J]. 2017 17TH INTERNATIONAL SYMPOSIUM ON COMMUNICATIONS AND INFORMATION TECHNOLOGIES (ISCIT), 2017,
  • [22] ISA based system design language in HW/SW co-design environment
    Yanagisawa, H
    Uehara, M
    Mori, H
    [J]. 13TH IEEE INTERNATIONAL WORKSHOP ON RAPID SYSTEM PROTOTYPING, PROCEEDINGS, 2002, : 122 - 127
  • [23] HW/SW co-design of an embedded omni-imaging system
    Xiong, Zhi-hui
    Cheng, Irene
    Zhang, Mao-jun
    Basu, Anup
    [J]. PROCEEDINGS 2012 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN, AND CYBERNETICS (SMC), 2012, : 3378 - 3383
  • [24] Design flow on a chip - An evolvable HW/SW platform
    Kubisch, S
    Hecht, R
    Timmermann, D
    [J]. ICAC 2005: Second International Conference on Autonomic Computing, Proceedings, 2005, : 393 - 394
  • [25] Chip-package-board co-design for Complex System-on-Chip (SoC)
    Patil, Mahendrasing
    Brahme, Amit
    Shust, Michael
    Coates, Keven
    Thatte, Shubhada
    Soman, Sreekanth
    Kumar, Kamal
    [J]. 2010 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGE & SYSTEMS SYMPOSIUM, 2010,
  • [26] Interface Design for Mapping a Variety of RSA Exponentiation Algorithms on a HW/SW Co-design Platform
    Uhsadel, Leif
    Ullrich, Markus
    Verbauwhede, Ingrid
    Preneel, Bart
    [J]. 2012 IEEE 23RD INTERNATIONAL CONFERENCE ON APPLICATION-SPECIFIC SYSTEMS, ARCHITECTURES AND PROCESSORS (ASAP), 2012, : 109 - 116
  • [27] Early Stage Chip/Package/Board Co-design Techniques for System-on-Chip
    Tanaka, Mikiko Sode
    Toyama, Masahiro
    Mori, Ryo
    Nakashima, Hidenari
    Haida, Masahiro
    Ooshima, Izumi
    [J]. 2011 IEEE 20TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2011, : 21 - 24
  • [28] HW/SW CO-Design for μClinux-Based Real-Time Platform
    Cayssials, Ricardo
    Ferro, Edgardo
    [J]. 2010 IEEE CONFERENCE ON EMERGING TECHNOLOGIES AND FACTORY AUTOMATION (ETFA), 2010,
  • [29] Optimal reconfigurable HW/SW co-design of load flow and optimal power flow computation
    Murach, M.
    Vachranukunkiet, P.
    Nagvajara, P.
    Johnson, J.
    Nwankpa, C.
    [J]. 2006 POWER ENGINEERING SOCIETY GENERAL MEETING, VOLS 1-9, 2006, : 1409 - +
  • [30] Achieving Energy Efficiency by HW/SW Co-design
    Borkar, Shekhar
    [J]. 2013 THIRD BERKELEY SYMPOSIUM ON ENERGY EFFICIENT ELECTRONIC SYSTEMS (E3S), 2013,