Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

被引：24
|
作者：
Xiao, Zhengxiang [1 ]
Xue, Songbai [1 ]
Hu, Yuhua [1 ]
Ye, Huan [1 ]
Gao, Lili [1 ]
Wang, Hui [1 ]
机构：
[1] Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2011年 / 22卷 / 06期
关键词：
WETTABILITY;
D O I：
10.1007/s10854-010-0192-x
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the present work, effects of trace amount of Pr on the microstructure, wettability and mechanical properties of Sn-9Zn solder were studied. The range of Pr content in Sn-9Zn solder alloys varied from 0.01 to 0.25 wt%. Test results indicate that adding appropriate amount of Pr can evidently improve the wettability and mechanical properties of the Sn-9Zn solder alloy. The Sn-9Zn-0.08Pr solder shows the best comprehensive properties compared to other solders with different Pr content. At the same time, notable changes in microstructure were found compared with the Pr-free alloy. The needle-like Zn-rich phase in the Sn-9Zn solder was refined and became more uniform. Moreover, the thickness of the IMC layer at Sn-9Zn/Cu substrate was remarkably depressed with Pr addition.
引用
收藏
页码：659 / 665
页数：7
相关论文
共 50 条
  • [31] Microstructure and properties of Sn-Zn-Ga-xPr lead-free solder
    Li, Yang
    Xue, Songbai
    Yang, Jingqiu
    Ye, Huan
    Chen, Cheng
    Gu, Liyong
    Gu, Wenhua
    Hanjie Xuebao/Transactions of the China Welding Institution, 2012, 33 (05): : 33 - 36
  • [32] Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder
    Wang, Hui
    Xue, Songbai
    Zhao, Feng
    Chen, Wenxue
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2010, 21 (02) : 111 - 119
  • [33] Study on the properties of Sn-9Zn-xCr lead-free solder
    Chen, Xi
    Hu, Anmin
    Li, Ming
    Mao, Dali
    Journal of Alloys and Compounds, 2008, 460 (1-2): : 478 - 484
  • [34] Study on the properties of Sn-9Zn-xCr lead-free solder
    Chen, Xi
    Hu, Anmin
    Li, Ming
    Mao, Dali
    JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 460 (1-2) : 478 - 484
  • [35] Investigation on properties of Ga to Sn–9Zn lead-free solder
    Wenxue Chen
    Songbai Xue
    Hui Wang
    Jianxin Wang
    Zongjie Han
    Journal of Materials Science: Materials in Electronics, 2010, 21 : 496 - 502
  • [36] Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints
    Shohji, Ikuo
    Shimoyama, Satoshi
    Ishikawa, Hisao
    Kojima, Masao
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII, 2008, 385-387 : 429 - +
  • [37] Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder
    Xu Chen
    Feng Xue
    Jian Zhou
    Sidong Liu
    Guotong Qian
    Journal of Electronic Materials, 2013, 42 : 2708 - 2715
  • [38] Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder
    Luo, Tingbi
    Hu, Anmin
    Hu, Jing
    Li, Ming
    Mao, Dali
    MICROELECTRONICS RELIABILITY, 2012, 52 (03) : 585 - 588
  • [39] Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder
    Chen, Xu
    Xue, Feng
    Zhou, Jian
    Liu, Sidong
    Qian, Guotong
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (08) : 2708 - 2715
  • [40] Effect of Cu addition on interfacial reactions between Sn-9Zn lead-free solder and Ni substrate
    Yen, Yee-wen
    Liou, Wei-kai
    JOURNAL OF MATERIALS RESEARCH, 2007, 22 (10) : 2663 - 2667
12345