Nanostructured Epoxy/POSS Composites: Enhanced Materials for High Voltage Insulation Applications

被引：28
|
作者：
Heid, Thomas [1 ]
Frechette, Michel [2 ]
David, Eric [1 ]
机构：
[1] ETS, Montreal, PQ H3C 1K3, Canada
[2] Inst Rech Hydroquebec IREQ, Varennes, PQ J3X 1S1, Canada
来源：
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION | 2015年 / 22卷 / 03期
基金：
加拿大自然科学与工程研究理事会;
关键词：
AC breakdown strength; dielectric spectroscopy; epoxy; electrical discharge; interface; polymer composites; POSS; surface erosion; thermal conductivity; DIELECTRIC-PROPERTIES; NANOCOMPOSITES;
D O I：
10.1109/TDEI.2015.7116355
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the dielectric and thermal properties of nanostructured epoxy/POSS (Polyhedral Oligomeric Silsesquioxanes) composites were investigated, using a reactive Triglycidylisobutyl-POSS (TGIB-POSS) additive from 1 up to 10 wt%. POSS has been successfully dispersed at a molecular level for low content composites, which show a remarkably improved resistance to corona discharges, with up to 60% less eroded sample volume, along with significantly increased dielectric breakdown strengths and thermal conductivities. Epoxy/POSS composites containing 5 wt% and more of the POSS additive exhibit agglomerations, which have been observed by SEM. Furthermore, dielectric spectroscopy revealed additional interfacial loss peaks for such composites containing 5 wt% POSS and more, in addition to the alpha- and beta-peaks known for epoxy.
引用
收藏
页码：1594 / 1604
页数：11
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