Low Temperature Deformation Detwinning-A Reverse Mode of Twinning

被引:25
|
作者
Wang, Yan-Dong [1 ]
Liu, Wenjun [2 ]
Lu, Lei [3 ]
Ren, Yang [2 ]
Nie, Zhi-Hua [1 ]
Almer, Jonathan [2 ]
Cheng, Sheng [4 ]
Shen, Yong-Feng [5 ]
Zuo, Liang [5 ]
Liaw, Peter K. [4 ]
Lu, Ke [3 ]
机构
[1] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China
[2] Argonne Natl Lab, Adv Photon Source, Argonne, IL 60439 USA
[3] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China
[4] Univ Tennessee, Dept Mat Sci & Engn, Knoxville, TN 37996 USA
[5] Northeastern Univ, Key Lab Anisotropy & Texture Mat, Minist Educ, Shenyang 110004, Peoples R China
基金
美国国家科学基金会; 中国国家自然科学基金;
关键词
NANOCRYSTALLINE METALS; ULTRAHIGH-STRENGTH; GRAIN-BOUNDARIES; RATE SENSITIVITY; COPPER; DISLOCATION; PLASTICITY; MICROSCOPY; MAXIMUM; GROWTH;
D O I
10.1002/adem.201000123
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The origin of the plasticity in bulk nanocrystalline metals have, to date, been attributed to the grain-boundary-mediated process, stress-induced grain coalescence, dislocation plasticity, and/or twinning. Here we report a different mechanism-detwinning, which operates at low temperatures during the tensile deformation of an electrodeposited Cu with a high density of nanosized growth twins. Both three-dimensional XRD microscopy using the Laue method with a submicron-sized polychromatic beam and high-energy XRD technique with a monochromatic beam provide the direct experimental evidences for low temperature detwinning of nanoscale twins.
引用
收藏
页码:906 / 911
页数:6
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