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- [1] Drop test reliability of wafer level chip scale packages 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 637 - 644
- [2] Board level drop test reliability of IC packages 55th Electronic Components & Technology Conference, Vols 1 and 2, 2005 Proceedings, 2005, : 630 - 636
- [3] JEDEC Board Drop Test Simulation for Wafer Level Packages (WLPs) 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 556 - +
- [5] Reliability of RDL structured Wafer Level Packages 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 1029 - +
- [6] Reliability of Fine Pitch Wafer Level Packages 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1097 - 1101
- [9] Study on the board level reliability test of package on package (PoP) with 2nd level underfill 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1905 - +