Reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation

被引:114
|
作者
Huang, W [1 ]
Askin, RG [1 ]
机构
[1] Univ Arizona, Dept Syst & Ind Engn, Tucson, AZ 85721 USA
关键词
reliability; electronic devices; competing failure modes; performance aging degradation; Weibull distribution;
D O I
10.1002/qre.524
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents an extension of reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation. The probability that a product fails on a specific mode is derived. Using this probability, the dominant failure mode on the product can be predicted. A practical example is presented to analyze an electronic device with two kinds of major failure modes-solder/Cu pad interface fracture (a catastrophic failure) and light intensity degradation (a degradation failure). Reliability modeling of an individual failure mode and device reliability analysis is presented and results are discussed. Copyright (C) 2003 John Wiley Sons, Ltd.
引用
收藏
页码:241 / 254
页数:14
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