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- [26] Applications of XPS and TOF-SIMS in the investigation of PCB Package Delamination [J]. PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 37 - 39
- [27] TOF-SIMS AND XPS INVESTIGATIONS OF FIBERS, COATINGS AND BIOMEDICAL MATERIALS [J]. FRESENIUS JOURNAL OF ANALYTICAL CHEMISTRY, 1995, 353 (5-8): : 487 - 493