On-chip thin film Peltier heat pumps

被引：0
|
作者：
Shafai, C [1 ]
Brett, MJ [1 ]
机构：
[1] Univ Manitoba, Dept Elect & Comp Engn, Winnipeg, MB R3T 5V6, Canada
来源：
THERMINIC: COLLECTION OF PAPERS PRESENTED AT THE INTERNATIONAL WORKSOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES | 1998年
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D O I：
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中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Thin film Au-Bi2Te3 based Peltier devices small enough to be constructed within IC circuitry were fabricated on micromachined SiO2 bridges. Bi2Te3 films were deposited by co-evaporation and patterned by photolithography and wet-chemical etching. These two-arm Peltier devices are capable of Delta T-max similar to 18 degrees C, with a thermal response time of similar to 2 ms/degrees C.
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页码：81 / 85
页数：5
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