Signal and power integrity co-simulation for multi-layered system on package modules

被引：0

作者：

Bharath, Krishna ^{[1
]}

Engin, Ege ^{[1
]}

Swaminathan, Madhavan ^{[1
]}

Uriu, Kazuhide ^{[2
]}

Yamada, Toru ^{[2
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

[2] Matsushita Elect Ind Co Ltd, Syst Engn Ctr, EMC Design Grp, Kadoma, Osaka, Japan

来源：

2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3 | 2007年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The coupling of simultaneous switching noise (SSN) in mixed signal system on package modules is a critical signal and power integrity (SI/PI) problem. In the presence of split planes and apertures, SSN coupling occurs both horizontally as well as vertically across layers. Thus, to catch SI and PI problems at an early stage of design requires fast signal and power co-simulation methodologies. In this paper, we outline the multi-layer finite difference method and how the accuracy of the technique can be enhanced with models for fringe and gap effects. We then briefly describe a method for integrating the signal distribution network with the power distribution network to enable co-simulation. The method is then applied to a mixed signal board containing split planes, and numerical results are compared to full-wave simulations.

引用

页码：65 / +

页数：2

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