High-performance Cooling System with Multi-channel Electro-osmotic Flow Pumps for High-power 3D-ICs

被引：0
|
作者：
Kudo, H. [1 ]
Yonekawa, T. [1 ]
Yoshimi, S. [1 ]
Oguri, Y.
Tsukune, A.
Kim, Y. S.
Kitada, H.
Fjimoto, K. [1 ]
Kinefuchi, I.
Matsumoto, Y.
Ohba, T.
机构：
[1] Dai Nippon Printing Co Ltd, MEMS Ctr, Kashiwa, Chiba 2770871, Japan
来源：
2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2014年
关键词：
Thermal management; Cooling system; 3D-ICs; Electro-osmotic flow pump;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system ((CS)-S-3) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the P-max of 1 x 10(4) Pa and Q(max) of 38 mu l/min. Cooling capability as high as 140 W/cm(2) was demonstrated for the first time.
引用
收藏
页码：480 / 483
页数：4
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