Contrastive Study on the mechanical performance of MEMS microsprings fabricated by LIGA and UV-LIGA technology

被引:0
|
作者
Li Hua [1 ,2 ]
Shi Gengchen [2 ]
机构
[1] Tsinghua Univ, Dept Precis Instruments & Mechanol, Beijing 100084, Peoples R China
[2] Beijing Inst Technol, Sch Aerosp Sci & Engn, Beijing 100081, Peoples R China
关键词
LIAG; UV-LIGA; Ni; microspring; spring constant;
D O I
10.1117/12.756048
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With good mechanical performance and mature fabrication technology of LIGA and UV-LIGA, Ni is chosen as the material of S style MEMS microspring. At 24 degrees C and 25% relative humidity, five different points in LIGA Ni sample were tested with the MICRO HARDNESS TESTER, and the Young's modulus was 219GPa. From the tensile tests of UV-LIGA Ni sample the Young's modulus of UV-LIGA Ni is 180GPa. The S style microspring was fabricated by LIGA and UV-LIGA technology separately. Applying the Castigliano second theorem of energy method in macro theory, the spring constant formulas of S style microspring in three application modes were deduced, and the correctness was verified by the FEA (Finite Element Analysis) simulation. The experiments of S style microspring's deformation properties were carried out by the Tytron250 micro force test machine and a tensile measurement system separately. The experimental results agree with the theoretical analysis. Based on the above analysis, the change laws of microspring's spring coefficient in different application patters are summarized.
引用
收藏
页数:10
相关论文
共 50 条
  • [11] Development of UV-LIGA Contact Probe
    Hsu, Hou-Jun
    Huang, Jung-Tang
    Lee, Kuo-Yu
    Tsai, Ting-Chiang
    2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2012,
  • [12] 基于UV-LIGA技术的新型RF MEMS开关
    张永华
    丁桂甫
    蔡炳初
    赖宗声
    微细加工技术, 2007, (01) : 60 - 64
  • [13] Research and development on Uv-Liga at HUST
    Xu, ZM
    He, SW
    Li, H
    Wang, SB
    Yi, XJ
    Lian, K
    Liu, S
    FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 190 - 194
  • [14] UV-LIGA光刻设备研究
    余国彬
    姚汉民
    胡松
    王兆志
    林大健
    电子工业专用设备, 2000, (04) : 26 - 29
  • [15] UV-LIGA: From Development to Commercialization
    Genolet, Gregoire
    Lorenz, Hubert
    MICROMACHINES, 2014, 5 (03): : 486 - 495
  • [16] Superplastic microforming of amorphous alloy with microdies fabricated by UV-LIGA process
    Saotome, Y
    Kurosawa, Y
    Kinuta, S
    Inoue, A
    MICRO MATERIALS, PROCEEDINGS, 2000, : 980 - 980
  • [17] Characteristics of torsional resonator with two degrees of freedom fabricated by UV-LIGA
    Usuda, T
    Basrour, S
    Majjad, H
    Coudevylle, JR
    de Labachelerie, M
    DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2002, 2002, 4755 : 594 - 600
  • [18] Implementation of eddy current sensor using UV-LIGA technology
    Zheng, Xiaohu
    Zhu, Di
    Zhongguo Jixie Gongcheng/China Mechanical Engineering, 2007, 18 (18): : 2156 - 2159
  • [19] Design and fabrication of an electrostatically suspended microgyroscope using UV-LIGA technology
    Cui, Feng
    Chen, Wenyuan
    Zhang, Weiping
    Xiao, Qijun
    Ma, Gaoyin
    Liu, Wu
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (12): : 1885 - 1896
  • [20] Study on electrocrystallization of pulse micro-electroforming in UV-LIGA
    Shao, Ligeng
    Du, Liqun
    Wang, Liding
    2007 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION, VOLS I-V, CONFERENCE PROCEEDINGS, 2007, : 2513 - 2517