Imprinting polymer film on patterned substrates

被引:29
|
作者
Tan, L
Kong, YP
Bao, LR
Huang, XD
Guo, LJ
Pang, SW [1 ]
Yee, AF
机构
[1] Univ Michigan, Dept Elect Engn & Comp Sci, Solid State Elect Lab, Ann Arbor, MI 48109 USA
[2] Inst Mat Res & Engn, Singapore 117602, Singapore
[3] Univ Michigan, Dept Mat Sci & Engn, Ann Arbor, MI 48109 USA
[4] Inst Mat Res & Engn, Singapore 117602, Singapore
[5] Univ Michigan, Dept Elect Engn & Comp Sci, Solid State Elect Lab, Ann Arbor, MI 48109 USA
[6] Inst Mat Res & Engn, Singapore 117602, Singapore
[7] Univ Michigan, Dept Mat Sci & Engn, Ann Arbor, MI 48109 USA
来源
关键词
D O I
10.1116/1.1624258
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have developed a technique to create polymer film patterns on substrates with microstructures using an elastomeric polydimethylsiloxane (PDMS) pad, wherein either a continuous or a patterned film on flat PDMS was used for pattern creation. During patterning of the continuous film, a polymer film is first spin coated onto the elastomer pad, and the pad is then brought into contact with the patterned substrate of interest. Since the PDMS can deform elastically around features on the substrate and its surface has low interfacial energy, films on PDMS can be successfully transferred onto the substrate. The resulting profile of the transferred film would depend on the pattern dimensions of the substrate, polymer properties, and conditions for imprinting. Three distinctive film patterns can be achieved, which we designate as continuous film transfer over microstructures, film transfer on both trenches and protrusions, and film transfer on protrusions. Interestingly, a negative replica of patterns on substrates can be simultaneously created on the PDMS pad in the last patterning process and the pattern can be further utilized in subsequent patterning steps. This affords the capability of transferring a patterned film from the PDMS to the sidewalls of the topographic features. Because of the great versatility of this patterning technique, it can be used to rapidly form channels, conformal coating on a patterned substrate, and micro- or nanometer sized patterns inside trenches of a patterned substrate. (C) 2003 American Vacuum Society.
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收藏
页码:2742 / 2748
页数:7
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