Low-power hermetically sealed on-chip plasma light source micromachined in glass

被引：0
|
作者：
Carazzetti, P. [1 ]
Renaud, Ph. [1 ]
Shea, H. [1 ]
机构：
[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland
来源：
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (< 500 mW) RF plasma.
引用
收藏
页码：818 / 821
页数：4
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