Special surface for power delivery to wireless micro-electro-mechanical systems

被引:5
|
作者
Martel, S [1 ]
机构
[1] Ecole Polytech, Dept Comp Engn, NanoRobot Lab, Montreal, PQ H3C 3A7, Canada
关键词
D O I
10.1088/0960-1317/15/10/S01
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports a special surface suitable to distribute power while providing a high-precision surface where wireless micro-electro-mechanical systems must operate. The surface is made of alternate electrically conducting and narrower insulating bands with dimensions that allow power to be delivered to the wireless systems when in contact with at least two electrically conductive bands. In this study, a first implementation using stainless steel 440C and black granite is analyzed in more detail. The dimensions of both the conducting and insulating bands are described by considering the properties of the materials used and the precision of the micro-mechanical systems that may be affected by features on the surface with dimensions down to the nanometer scale. The effects on the dimensions of the bands due to the total mass of each microsystem, the contact surface area between the microsystems and the powering surface, and the accuracy of the positioning system used, are also taken into account. Minimum widths of the insulating bands and the methods to prevent electrical shorts between a pair of successive bands, created through arcing between the conductive bands and a conductive structure of the wireless units when stationary or transiting through an insulating band, are also evaluated and compared when operating in air or helium atmosphere.
引用
下载
收藏
页码:S251 / S258
页数:8
相关论文
共 50 条
  • [31] Micro-electro-mechanical focusing mirrors
    Burns, DM
    Bright, VM
    MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, : 460 - 465
  • [32] Review on pressure sensors: a perspective from mechanical to micro-electro-mechanical systems
    Jena, Sudarsana
    Gupta, Ankur
    SENSOR REVIEW, 2021, 41 (03) : 320 - 329
  • [33] Wafer-level packaging for micro-electro-mechanical systems using surface activated bonding
    Takegawa, Yoshiyuki
    Baba, Toru
    Okudo, Takafumi
    Suzuki, Yuji
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2007, 46 (4B): : 2768 - 2770
  • [34] Investigation of the maximum optical power rating for a micro-electro-mechanical device
    Burns, DM
    Bright, VM
    TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 1997, : 335 - 338
  • [35] Implementation of Micro-Electro-Mechanical Systems for Broadband Folded Dipole Array
    Jiang Chang
    Fang Wei
    PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON INFORMATION ENGINEERING FOR MECHANICS AND MATERIALS, 2015, 21 : 451 - 454
  • [36] Micro-electro-mechanical deformable mirrors for aberration control in optical systems
    Roggemann, MC
    Bright, VM
    Welsh, BM
    Cowan, WD
    Lee, M
    OPTICAL AND QUANTUM ELECTRONICS, 1999, 31 (5-7) : 451 - 468
  • [37] Micro-electro-mechanical deformable mirrors for aberration control in optical systems
    Michael C. Roggemann
    Victor M. Bright
    Byron M. Welsh
    William D. Cowan
    Max Lee
    Optical and Quantum Electronics, 1999, 31 : 451 - 468
  • [38] A Comparison of Neural Networks to Detect Failures in Micro-Electro-Mechanical Systems
    Angel F, Julian M.
    Gamboa Higuera, Juan C.
    Avila Bernal, Alba G.
    Villarraga Pinzon, Carlos E.
    2010 IEEE ELECTRONICS, ROBOTICS AND AUTOMOTIVE MECHANICS CONFERENCE (CERMA 2010), 2010, : 191 - 196
  • [39] Bounded-but-unknown uncertainty optimization of micro-electro-mechanical systems
    Gurav, SP
    Langelaar, M
    Goosen, JFL
    van Keulen, F
    COMPUTATIONAL FLUID AND SOLID MECHANICS 2003, VOLS 1 AND 2, PROCEEDINGS, 2003, : 2291 - 2293
  • [40] Noise reduction and estimation in multiple micro-electro-mechanical inertial systems
    Waegli, Adrian
    Skaloud, Jan
    Guerrier, Stephane
    Eulalia Pares, Maria
    Colomina, Ismael
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2010, 21 (06)