Lithography-free high aspect ratio submicron quartz columns by reactive ion etching

被引:10
|
作者
Zeze, DA [1 ]
Cox, DC [1 ]
Weiss, BL [1 ]
Silva, SRP [1 ]
机构
[1] Univ Surrey, Sch Elect & Phys Sci, Adv Technol Inst, Guildford GU2 7XH, Surrey, England
关键词
D O I
10.1063/1.1647280
中图分类号
O59 [应用物理学];
学科分类号
摘要
We describe lithography-free fabrication of sub-micron surface features on quartz substrates by the reactive ion etching (RIE) in a CF4/Ar atmosphere. These submicron glass columns are well defined, have a high aspect ratio, with the underlying substrate being very flat. The geometry of the fabricated surface columns is dependent on the RIE process parameters. The analysis of these glass columns shows that a differential etching process takes place. The optical characterization of these samples shows a significant absorption at visible wavelengths whereas the relative transmission is very high in the infrared range, suggesting that these samples could potentially be used for wavelength selection device applications. (C) 2004 American Institute of Physics.
引用
收藏
页码:1362 / 1364
页数:3
相关论文
共 50 条
  • [1] Aspect ratio dependent etching in advanced Deep Reactive Ion Etching of quartz
    Chapellier, P.
    Lavenus, P.
    Bourgeteau-Verlhac, B.
    Gageant, C.
    Le Traon, O.
    Dulmet, B.
    [J]. 2017 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP 2017), 2017,
  • [2] Reactive ion etching for high aspect ratio silicon micromachining
    Rangelow, IW
    [J]. SURFACE & COATINGS TECHNOLOGY, 1997, 97 (1-3): : 140 - 150
  • [3] FABRICATION OF DEEP SUBMICRON PATTERNS WITH HIGH ASPECT RATIO USING MAGNETRON REACTIVE ION ETCHING AND SIDEWALL PROCESS
    GAO, SP
    CHEN, MZ
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1992, 10 (06): : 2708 - 2710
  • [4] Deep reactive ion etching for high aspect ratio microelectromechanical components
    Jensen, Soren
    Yalcinkaya, Arda D.
    Jacobsen, Soren
    Rasmussen, Torben
    Rasmussen, Frank Engel
    Hansen, Ole
    [J]. PHYSICA SCRIPTA, 2004, T114 : 188 - 192
  • [5] REACTIVE ION ETCHING FOR PATTERNING HIGH ASPECT RATIO AND NANOSCALE FEATURES
    Avram, M.
    Avram, A.
    Comanescu, F.
    Popescu, A. M.
    Voitincu, C.
    [J]. CAS: 2009 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2009, : 253 - 256
  • [6] CONDUCTANCE CONSIDERATIONS IN THE REACTIVE ION ETCHING OF HIGH ASPECT RATIO FEATURES
    COBURN, JW
    WINTERS, HF
    [J]. APPLIED PHYSICS LETTERS, 1989, 55 (26) : 2730 - 2732
  • [7] High Aspect Ratio Machining of Nanocarbon Materials by Reactive Ion Etching
    Atsuko Sekiguchi
    Don N. Futaba
    Takeo Yamada
    Kenji Hata
    [J]. MRS Advances, 2017, 2 (1) : 9 - 14
  • [8] High-aspect-ratio nanoporous membranes made by reactive ion etching and e-beam and interference lithography
    Divan, Ralu
    Makarova, Olga V.
    Skoog, Shelby
    Narayan, Roger
    Sumant, Anirudha V.
    Tang, Cha-Mei
    Moldovan, Nicolaie
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2014, 20 (10-11): : 1797 - 1802
  • [9] High-aspect-ratio nanoporous membranes made by reactive ion etching and e-beam and interference lithography
    Ralu Divan
    Olga V. Makarova
    Shelby Skoog
    Roger Narayan
    Anirudha V. Sumant
    Cha-Mei Tang
    Nicolaie Moldovan
    [J]. Microsystem Technologies, 2014, 20 : 1797 - 1802
  • [10] Submicron-patterning of bulk titanium by nanoimprint lithography and reactive ion etching
    Domanski, M.
    Luttge, R.
    Lamers, E.
    Walboomers, X. F.
    Winnubst, L.
    Jansen, J. A.
    Gardeniers, J. G. E.
    [J]. NANOTECHNOLOGY, 2012, 23 (06)