Adhesive influence modeling on double-lap joints assemblies

被引：0
|
作者：
Nemes, Ovidiu [1 ]
机构：
[1] Tech Univ, Cluj Napoca, Romania
来源：
STUDIA UNIVERSITATIS BABES-BOLYAI CHEMIA | 2007年 / 52卷 / 04期
关键词：
stress analysis; adhesives; numerical modeling;
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
The paper presents a numerical analysis of metal-composites plane assemblies joined with adhesive. After the CAD model, constraints and applied load definition, we made a stress field analysis. The aim of this work is to validate an analytical model, based on an energy method, developed by the author. Thus the analytical model makes it possible to determine the rigidity of the assembly and to obtain a simple formulation very rapidly which gives the total behavior of the assembly.
引用
收藏
页码：175 / 181
页数：7
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