Severe deformation twinning in pure copper by cryogenic wire drawing

被引:41
|
作者
Kauffmann, A. [1 ,2 ]
Freudenberger, J. [1 ,3 ]
Geissler, D. [1 ,2 ]
Yin, S. [1 ,2 ]
Schillinger, W. [4 ]
Sarma, V. Subramanya [5 ]
Bahmanpour, H. [6 ]
Scattergood, R. [6 ]
Khoshkhoo, M. S. [1 ]
Wendrock, H. [1 ]
Koch, C. C. [6 ]
Eckert, J. [1 ,2 ]
Schultz, L. [1 ,2 ]
机构
[1] IFW Dresden, D-01171 Dresden, Germany
[2] Tech Univ Dresden, Inst Mat Sci, D-01062 Dresden, Germany
[3] TU Bergakad Freiberg, Inst Mat Sci, D-09596 Freiberg, Germany
[4] Wieland Werke AG, D-89079 Ulm, Germany
[5] Indian Inst Technol, Dept Met & Mat Engn, Madras 600036, Tamil Nadu, India
[6] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
关键词
Deformation twinning; Copper; Low-temperature deformation; Stress state; Resolved shear stress; HIGH ELECTRICAL-CONDUCTIVITY; DYNAMIC PLASTIC-DEFORMATION; SINGLE-CRYSTALS; HIGH-STRENGTH; FCC METALS; BEHAVIOR; CU; TEMPERATURES; TWINS; BULK;
D O I
10.1016/j.actamat.2011.08.042
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of low-temperature on the active deformation mechanism is studied in pure copper. For this purpose, cryogenic wire drawing at liquid nitrogen temperature (77 K) was performed using molybdenum disulfide lubrication. Microstructural investigation and texture analysis revealed severe twin formation in the cryogenically drawn copper, with a broad twin size distribution. The spacing of the observed deformation twins ranges from below 100 nm, as reported in previous investigations, up to several micrometers. The extent of twin formation, which is significantly higher when compared to other cryo-deformation techniques, is discussed with respect to the state of stress and the texture evolution during wire drawing. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:7816 / 7823
页数:8
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